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Shenzhen SiCarrier Technologies backed by Huawei, has been developing equipment that can produce 28nm chips!

Stan Chen

New member
Shenzhen SiCarrier Technologies (新凯来), backed by Shenzhen municipal government and linked to Huawei, has been developing equipment in chip fabrication and has set machines from companies such as ASML, Applied Materials and Lam Research as its benchmark. The machines it is working on involve lithography, chemical vapor deposition, measurement, physical vapor deposition, etching and atomic layer deposition, all fields that are currently dominated by companies from the Netherlands, US and Japan.

SiCarrier has been working closely with Huawei's growing team of specialists in chip production and chip equipment making.SiCarrier claims it has built critical lithography machines that can produce 28nm chips or less advanced chips, a segment currently dominated by ASML, Nikon and Canon. However, it is still hard to verify whether the company will be able to smoothly commercialize such machines.

Chips in the 28nm range are viewed as mature technology, far less advanced than chips built with 5nm or 4nm processes that currently only TSMC, Samsung and Intel are able to produce. Such chips can are important, however, as they are used in a wide range of applications, including microcontrollers for cars and advanced robotics.

"They have started many projects across many different process steps in chipmaking, basically hoping to build all types of machines. They are working very closely with needs and requests from Huawei. ...

Some projects involve hundreds of workers, while others involve thousands of engineers.” SiCarrier has been aggressively hiring experienced engineers from foreign peers in recent years, especially after tighter US export controls led many American chip tool makers in China to downsize.“It is a young company, but they've managed to hire and form a big team with experienced talent from the industry.

”In a recent post on WeChat, SiCarrier said it will launch a wide range of chipmaking equipment machines during the SEMICON China industry fair this week, including a new atomic layer deposition (ALD) tool named Alishan after a famous mountain in Taiwan.Huawei has dedicated substantial resources to developing chipmaking equipment, actively recruiting top engineers with experience at chip leaders such as TSMC and Intel, and major global equipment manufacturers including ASML, Applied Materials, Lam Research, KLA, Tokyo Electron and Screen.

The Chinese tech giant is also building a massive research and development complex for chipmaking machines in Shanghai. Huawei has been collaborating closely with SiCarrier to jointly enhance application engineering expertise and identify key production challenges when implementing chip manufacturing processes

.SiCarrier was founded in Aug 2021 and its major stakeholder is Shenzhen Major Industry Investment Group (深圳市重大产业投资集团), an investment vehicle of the Shenzhen government, which is also a major backer of Huawei-linked chip manufacturers including PengXinWei Integrated Circuit Manufacturing Co (鹏芯微) and SwaySure Technology (昇維旭).

 
This is the WFE section of SiCarrier website
View attachment 2914
The products under development typically will not be in the website, but some propaganda might be intendedly leaked. There will be no doubt that China is capable for aligner/stepper or scanner used in 3D package technologies. For DUV, it is challenging but still could be achievable. For EUV whole integrated and production ready scanner, it is not possible to be ready by 2026 or even 2030.
 
The products under development typically will not be in the website, but some propaganda might be intendedly leaked. There will be no doubt that China is capable for aligner/stepper or scanner used in 3D package technologies. For DUV, it is challenging but still could be achievable. For EUV whole integrated and production ready scanner, it is not possible to be ready by 2026 or even 2030.
It feels like a Great Leap Forward fantasy to jump from basic IGBT assembly and test tools to challenging giants like Applied Materials, Tokyo Electron, and ASML in full-spectrum WFE. Their website shows a shaky foundation—let’s see if Semicon China 2025 reveals anything beyond hype tomorrow
 
It's amusing how they name all their instruments after mountains in China (though Alishan is actually in Taiwan). It seems like a perfect match with Intel, who names all their CPUs after lakes.
 
Wow, there must be some magicians created so many new tools in one shot. AMAT , KLA will be in jeopardy for their >30% revenue from China. By the way, where is the EUV I expected?
Twinscan EXE:5000 LEGO run $230 a pop. So, what’s the sticker price on these Huawei-backed SiCarrier ‘tool lego’ they’re stacking at Semicon China? Let’s get serious: how many will they actually make and sell by end of 2025—or even 2030? I’m guessing a handful, tops
 
I’ve attended Semicon West many times and never seen an established WFE manufacturer display only ‘tool Legos’ at the show. Big players like Applied Materials, Lam Research, Tokyo Electron, and ASML always roll out real, operational equipment or near-production prototypes—it’s their key stage to prove capability and lock in orders
 
you didn't see them doesn't mean they are not there, just that they don't want you to find. but since this company is majorly supported by Huawei/China government, we can simply observe Huawei's products process progress. So far, Huawei products process still stay in 14nm++ (maybe ~7nm) with SMIC process, let's see when Huawei use their foundry with such equipments to roll out products.
 
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