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Samsung Electronics is ramping up production of its most advanced logic chips following record-high memory chip sales in the third quarter of 2025. The company reported surging demand for high-bandwidth memory (HBM) and solid-state drives used in artificial intelligence (AI) servers, driving its semiconductor division to its strongest performance in years. With the memory market rebounding sharply, Samsung is now turning its focus toward expanding its foundry and advanced packaging capacity to compete more aggressively with TSMC.
Executives said Samsung plans to boost output of 3-nanometer gate-all-around (GAA) chips and accelerate development of next-generation 2nm technology at its Giheung and Pyeongtaek fabs. The company is also increasing investments in AI accelerators, advanced DRAM such as HBM4, and chiplet-based designs to capitalize on the AI-driven boom.
Samsung’s foundry unit has lagged TSMC in both yield and customer adoption, but stronger profitability from its memory business is giving it the financial flexibility to expand aggressively. Analysts expect Samsung’s dual strength in memory and logic manufacturing to help it capture a larger share of the AI semiconductor market in 2026 and beyond, marking a renewed push to close the gap with its Taiwanese rival.
Samsung beefs up advanced chip output after memory chip sales hit record high
Samsung Electronics expects demand for memory chips for the global AI infrastructure build-out to far outstrip the company's supply, and said on Thursday it will focus on mass producing its most advanced chips to capitalise on the boom.
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