Hi,
In the source that I came across, it is mentioned that the physical limit from theoretical physics perspective for binary logic devices is 1 x 3 nm^2.
With the insulation circumferences the device, 1 device ends up taking 2 x 4 nm^2.
So far, the discussion about device scaling limitation that I found is mostly from the Lithography perspective.
let's say, we are able to overcome the lithography challenges to fabricate the device and delay the end of Moore's Law for a few technological nodes.
my questions:
1. between current state of the art technology (Lithography limitation) and that physical limits from theoretical physics, how much room do we still have actually?
2. Has this limit ever been discussed in the international conferences like IEDM, IMEC yearly meeting, etc? If yes, what are their opinion about a conclusion/prediction like that?
source
paper
the same author also wrote a chapter in a book.
In the source that I came across, it is mentioned that the physical limit from theoretical physics perspective for binary logic devices is 1 x 3 nm^2.
With the insulation circumferences the device, 1 device ends up taking 2 x 4 nm^2.
So far, the discussion about device scaling limitation that I found is mostly from the Lithography perspective.
let's say, we are able to overcome the lithography challenges to fabricate the device and delay the end of Moore's Law for a few technological nodes.
my questions:
1. between current state of the art technology (Lithography limitation) and that physical limits from theoretical physics, how much room do we still have actually?
2. Has this limit ever been discussed in the international conferences like IEDM, IMEC yearly meeting, etc? If yes, what are their opinion about a conclusion/prediction like that?
source
paper
Code:
https://ieeexplore.ieee.org/document/4567291
the same author also wrote a chapter in a book.
Code:
https://www.springer.com/in/book/9789048193783