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Intel better positioned than Taiwan Semiconductor, Northland Capital opines

Daniel Nenni

Daniel Nenni

Admin
Staff member
Intel’s (NASDAQ:INTC) got a fan at Northland Capital Markets.

Analyst Gus Richard said he’s “confident” in the company’s execution and expects Intel (INTC) to gain share in x86 microprocessors next year.

“We believe system-in-package will fundamentally change the semiconductor industry,” Richard wrote in a note. “Over time, fabless and IP companies will sell chiplets rather than chips and IP, respectively.”

Richard added that Taiwan Semiconductor (NYSE:TSM) and Intel will dominate the system foundry market, and as such, outsourced semiconductor assembly and test, or OSATs, vendors of system-in-package, or SiP, will be "disintermediated."

He explained that this evolution will take time to happen, but evidence is mounting that it occurs and as such, Intel is “better positioned than widely recognized.”

Shares of Intel (INTC) are up 1.8% on Tuesday.

Advanced Packaging is the low-hanging fruit driving small, faster and cheaper product, Richard explained. As such, OSATs don't have the technology to compete against Intel (INTC) and Taiwan Semiconductor (TSM) in the system-in-packaging market.

Intel (INTC) added two unnamed packaging customers in the third-quarter, with six more in the pipeline because Taiwan Semi's (TSM) advanced packaging capacity is sold out, and there is no other alternative to Intel (INTC), Richard explained.

Northland said it sees Intel (INTC) executing its process technology roadmap and becoming increasingly competitive. “We see no architectural lever that will offset the process technology advantage over the next few years,” Richard posited.

There is also opportunity in system-in-package — a method used for bundling multiple integrated circuits and components into a single package.

Apple (AAPL), Tesla (TSLA), Amazon (AMZN), Google (GOOG) and Microsoft (MSFT) are making their own chips, which can be included in Intel’s (INTC) SiP products with an x86 and other CPUs.

“We do not think this would cannibalize the x86 market but expand INTC [foundry services] revenue opportunity,” Richard said.

Shares of Intel (INTC) are up nearly 39% year-to-date.

seekingalpha.com

Intel better positioned than Taiwan Semiconductor, Northland Capital opines

Intel’s (INTC) got a fan at Northland Capital Markets. Read more.
seekingalpha.com seekingalpha.com
 
HYB said:
One of the packaging customers that was added was NVIDIA
Click to expand...

Agreed. Packaging is critical and Intel made the wise decision to package other foundries wafers which TSMC does not. Since they are packaging constrained now I see the value in TSMC's decision but that may change of course. Samsung is working the packaging angle as well but they are behind Intel and TSMC.

Bottom line: If you are packaging chips for the top semiconductor companies you will have a good shot at getting the wafer business as well, absolutely.

As for the title of the article, seriously?
 
Perhaps he had ChatGPT write the article for him. :rolleyes:

This line is clearly a hallucination:

Apple (AAPL), Tesla (TSLA), Amazon (AMZN), Google (GOOG) and Microsoft (MSFT) are making their own chips, which can be included in Intel’s (INTC) SiP products with an x86 and other CPUs.
Click to expand...
These five companies don't "make" their own chips, they design some of their chips. As for including them in an Intel x86 CPU package, now that's ridiculous.
 
blueone said:
Perhaps he had ChatGPT write the article for him. :rolleyes:

This line is clearly a hallucination:


These five companies don't "make" their own chips, they design some of their chips. As for including them in an Intel x86 CPU package, now that's ridiculous.
Click to expand...

That probably explains why this strange comment from the author:

"“We believe system-in-package will fundamentally change the semiconductor industry,” Richard wrote in a note. “Over time, fabless and IP companies will sell chiplets rather than chips and IP, respectively.”"
 
I continue to be amazed by the poor quality of most articles about semiconductor technologies and the companies that make up the ecosystem, especially the manufacturing ecosystem. I can't think of another field where typical article quality is so low.
 
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