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Intel 18A Process Node Offers 25% Higher Frequency At ISO & 36% Lower Power At Same Frequency Versus Intel 3, Over 30% Density

semiman said:
Then do we have front pads(which is connected to DRAM and platform) and back pads(power and ground) now? AFAIK Intel 3nm PowerVia test chip (E-core chip) didn't look like that.
Click to expand...
No, the normal I/O pads are on the backside along the the power rails and PWR/GND pads -- also anything else that needs thick low-resistance metal e.g. inductors and transmission lines in high-speed SERDES.
 
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