Muhammad Zuhair
•Mar 6, 2026 at 01:15pm EST
Intel's packaging services are being considered a viable alternative to TSMC's CoWoS, as supply constraints are forcing US fabless customers to seek other options.
"On EMIB, or EMIB-T. This looks like a great offering for us, and we’ve gotten, I think, really good engagement from customers on this business. Originally, when I was thinking about it and talking to investors, I was calibrating everybody to, "Hey, this is like a. You know, think about these wins in the $100s of millions versus, you know, wafer wins, which would be in the $billions.
You know, that’s the way you should think about it." Now I’ve since revised that because we’re actually, you know, at the close to closing some deals that are in the billions per year."
- Intel's CFO David Zinsner
The talk of customers seeking EMIB had emerged at the start of the year, especially after NVIDIA's CEO, Jensen Huang, praised Intel's packaging solutions during the $5 billion deal announcement. One of the primary reasons EMIB and EMIB-T have seen greater interest recently is that Intel's advanced packaging capacity lines are unconstrained. Beyond the technological advantages EMIB offers, access to capacity is a major selling point for fabless manufacturers.
A DigiTimes report reveals that confidence in Intel's advanced packaging solutions has risen significantly in recent times, driven by the company's close collaboration with IC substrate suppliers in Japan and Taiwan. Intel's suppliers are reportedly boosting production capacity, hoping to capitalize on the incoming demand for packaging products, which is an indirect indicator that the adoption of EMIB is transitioning from a mere concept to actual order volume.
Intel's EMIB and EMIB-T technologies are currently seen as a viable option for solutions that prioritize cost-efficiency, massive physical scale, and design flexibility over absolute peak bandwidth. This means that ASICs, mobile SoCs, and custom silicon will be the primary candidates for adopting Intel's packaging services. Right now, reports suggest that NVIDIA is looking to EMIB for its Feynman chips, while Apple, MediaTek, and Qualcomm could adopt it for their custom chip solutions.
Another major selling point for Intel's advanced packaging (AP) services is their heavy focus on domestic manufacturing. Right now, the US doesn't have AP facilities other than Intel's, which means that for fabless manufacturers placing orders with TSMC Arizona, they would essentially need to ship 'half-baked' solutions to Taiwan to get them packaged. Team Blue's EMIB solution bridges this gap, which is one of the reasons for the company's massive prospects in the backend segment.
wccftech.com
•Mar 6, 2026 at 01:15pm EST
Intel's packaging services are being considered a viable alternative to TSMC's CoWoS, as supply constraints are forcing US fabless customers to seek other options.
Intel's EMIB Packaging Orders Could Reach 'Billions in Revenue' Moving Into H2 2026; a New Prospect For the Foundry Business
Advanced packaging has emerged as a major driver of computing power in modern-day AI architectures, and alongside semiconductors, solutions like CoWoS are seen as vital for firms like NVIDIA and AMD. With the start of the AI frenzy, advanced packaging has been dominated by TSMC, but as demand for CoWoS and derivatives ramps up, a supply bottleneck has emerged that will take time to resolve. At the same time, packaging customers are seeing Intel's EMIB as a suitable 'fallback' option, which is why Intel reports demand that would bring 'billions in revenue'."On EMIB, or EMIB-T. This looks like a great offering for us, and we’ve gotten, I think, really good engagement from customers on this business. Originally, when I was thinking about it and talking to investors, I was calibrating everybody to, "Hey, this is like a. You know, think about these wins in the $100s of millions versus, you know, wafer wins, which would be in the $billions.
You know, that’s the way you should think about it." Now I’ve since revised that because we’re actually, you know, at the close to closing some deals that are in the billions per year."
- Intel's CFO David Zinsner
The talk of customers seeking EMIB had emerged at the start of the year, especially after NVIDIA's CEO, Jensen Huang, praised Intel's packaging solutions during the $5 billion deal announcement. One of the primary reasons EMIB and EMIB-T have seen greater interest recently is that Intel's advanced packaging capacity lines are unconstrained. Beyond the technological advantages EMIB offers, access to capacity is a major selling point for fabless manufacturers.
A DigiTimes report reveals that confidence in Intel's advanced packaging solutions has risen significantly in recent times, driven by the company's close collaboration with IC substrate suppliers in Japan and Taiwan. Intel's suppliers are reportedly boosting production capacity, hoping to capitalize on the incoming demand for packaging products, which is an indirect indicator that the adoption of EMIB is transitioning from a mere concept to actual order volume.
Intel's EMIB and EMIB-T technologies are currently seen as a viable option for solutions that prioritize cost-efficiency, massive physical scale, and design flexibility over absolute peak bandwidth. This means that ASICs, mobile SoCs, and custom silicon will be the primary candidates for adopting Intel's packaging services. Right now, reports suggest that NVIDIA is looking to EMIB for its Feynman chips, while Apple, MediaTek, and Qualcomm could adopt it for their custom chip solutions.
Another major selling point for Intel's advanced packaging (AP) services is their heavy focus on domestic manufacturing. Right now, the US doesn't have AP facilities other than Intel's, which means that for fabless manufacturers placing orders with TSMC Arizona, they would essentially need to ship 'half-baked' solutions to Taiwan to get them packaged. Team Blue's EMIB solution bridges this gap, which is one of the reasons for the company's massive prospects in the backend segment.
Intel's EMIB Challenges TSMC's CoWoS as America's Answer to the AI Packaging Bottleneck
Intel's packaging is being considered an alternative to TSMC's CoWoS, as supply constraints are forcing US customers to seek other options.
wccftech.com