KnowMade
New member
A KnowMade Insight about Advanced Packaging:
SOPHIA ANTIPOLIS, France – January 9, 2025 │ Advanced semiconductor packaging is a rapidly evolving field where multiple technologies are being developed simultaneously. The integration of glass into substrates and interposers within semiconductor packages has the potential to accelerate the development of emerging technologies targeting applications such as artificial intelligence (AI), high-performance computing (HPC) and next-generation photonics-based computing.
SOPHIA ANTIPOLIS, France – January 9, 2025 │ Advanced semiconductor packaging is a rapidly evolving field where multiple technologies are being developed simultaneously. The integration of glass into substrates and interposers within semiconductor packages has the potential to accelerate the development of emerging technologies targeting applications such as artificial intelligence (AI), high-performance computing (HPC) and next-generation photonics-based computing.
Rising patent activity and competition within the semiconductor industry
Glass, as a packaging material, offers significant advantages over organic core substrates and silicon interposers. Its stiffness minimizes warpage when multiple chips are integrated, ensuring improved reliability and performance. Additionally, the transparency of glass enables new possibilities for co-packaging photonic and electronic components, paving the way for innovative devices integrating photonic integrated circuits (PIC) and electronic integrated circuits (EIC). This dual functionality positions glass a potentially game-changing material in advanced semiconductor packaging.
Patenting activities related to glass core substrates and interposers for advanced semiconductor packaging are relatively recent and accelerating (Figure 1). Before 2020, no clear intellectual property (IP) leaders had emerged, although patent filings began increasing around 2015 from players such as Toppan, Corning, NCAP, and GlobalFoundries. Since 2020, the landscape has shifted, with Intel emerging as the leading patent assignee, currently holding nearly half of the patents in this field.
Patenting activities related to glass core substrates and interposers for advanced semiconductor packaging are relatively recent and accelerating (Figure 1). Before 2020, no clear intellectual property (IP) leaders had emerged, although patent filings began increasing around 2015 from players such as Toppan, Corning, NCAP, and GlobalFoundries. Since 2020, the landscape has shifted, with Intel emerging as the leading patent assignee, currently holding nearly half of the patents in this field.
Figure 1: Time evolution of patent publications related to glass core substrates and glass interposers for advanced semiconductor packaging.
Intel stands out for its prolific patenting activity, showcasing a well-balanced patent portfolio that encompasses both glass core substrates and glass interposers, reflecting its strategic commitment to the field. Absolics, a subsidiary of SK Group, is the closest IP competitor, with a patent portfolio focused on glass core substrates. The remaining half of the patent corpus is highly fragmented, with over 150 patent applications filed by approximately 70 companies, each holding only a relatively small number of patents. This diversity highlights the various approaches being pursued to drive innovation in the field. Notably, an increasing number of companies have entered the IP race in recent years, including Samsung, and Chinese firms such as SJ Semi, Xiamen Sky Semiconductor, and Huawei, reflecting the growing industry interest in glass-based packaging.
Read full article: https://www.knowmade.com/technology...hts-from-the-intellectual-property-landscape/