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A Discussion of how a Multi-Physics Design Cockpit can cope with the Challenges and Strategies for Heterogeneous 3D Integration – With Daniel Nenni and Anna Fontanelli.
3D heterogeneous integration is a promising technology that can improve the performance and power efficiency of microelectronic devices. However, there are several technical challenges created by the combined effects of several different physical factors (electrical, thermal, mechanical) that need to be solved all together to make it a successful design approach.
A Multi-physics design cockpit, a specialized software environment that enables engineers to design and analyze complex 3D integrated circuits (ICs) while considering the interplay of various physical phenomena, is a crucial tool for enabling the successful development of advanced 3D heterogeneous systems in microelectronics.
This video will highlight the key role GENIOEVO is playing as a Multi-physics cockpit for 3D heterogeneous integration.
