Daniel Payne
Moderator
TSMC VP of R&D to discuss industry opportunities in sub-10nm era
Louisville, Colo. -- January 16, 2014 -- Cliff Hou, PhD, will be a keynote
presenter in June 2014 at the Design Automation Conference (DAC),
the premier conference devoted to the design and
automation of electronic systems. Dr. Hou will discuss how the introduction
of 10nm and 7nm processes will alter today's ecosystem while opening greater
EDA and IP opportunities, and will present new system and chip designs. The
51st DAC will be held at the Moscone Convention Center in San Francisco,
California from June 1-5, 2014.
Dr. Hou will highlight how continued chip- and wafer-based scaling will
deliver the power and performance necessary to deliver wondrous new
applications. A grand alliance of design ecosystem, equipment and material
suppliers will result in production at 10nm and heterogeneous silicon
integration that combines chips from multiple process technologies with 3D
packaging to deliver compelling economics for a "System in a Si Superchip."
He will discuss the new design techniques and system and chip design
challenges likely to be faced by the electronics design and supply
ecosystem, outlining the need for even greater levels of collaboration and
cooperation.
"Industry Opportunities in the Sub-10nm Era" will be presented at 3:00pm on
Monday, June 2, 2014 at DAC.
Along with exciting keynotes, DAC 2014 will feature three new tracks
focused on automotive, Intellectual Property (IP) and security, while
keeping the tradition of offering the best-in-class solutions that promise
to advance electronic design automation (EDA) and embedded systems and
software (ESS).
As the primary venue for the design and automation of electronic systems,
DAC offers outstanding training, education, exhibits and superb networking
opportunities for designers, researchers, tool developers and vendors. For
more information visit www.dac.com
About Dr. Hou
Dr. Cliff Hou was appointed in 2011 as TSMC's Vice President of R&D. He
joined TSMC in 1997. He was previously a Senior Director for Design and
Technology Platform, where he established the company's technology design
kit. He also led TSMC's in-house IP development teams from 2008 to 2010.
Before TSMC, Dr. Hou was with Taiwan's national telecommunications
laboratory, ITRI/CCL, where he workedin front-end design environment
development and as a consultant specializing in physical verification
methodologies. Dr. Hou served as an Associate Professor at Kaohsiung
Polytechnic Institute in Taiwan.
Dr. Hou holds 20 U.S. Patents and serves as a board member of Global Unichip
Corp. He received his B.S. degree in control engineering from Taiwan's
National Chiao-Tung University, and Ph.D. in electrical and computer
engineering from Syracuse University.
About DAC
The Design Automation Conference (DAC) is recognized as the premier event
for the design of electronic circuits and systems and for electronic design
automation (EDA) and silicon solutions. Since 1964, a diverse worldwide
community of many thousands of professionals has attended DAC. They include
system designers and architects, logic and circuit designers, validation
engineers, CAD managers, senior managers and executives as well as
researchers and academicians from leading universities. Close to 60
technical sessions selected by a committee of electronic design experts
offer information on recent developments and trends, management practices
and new products, and methodologies and technologies. A highlight of DAC is
its exhibition and suite area featuring leading and emerging EDA, silicon,
intellectual property (IP) automotive, security and design services
providers. The conference is sponsored by the Association for Computing
Machinery (ACM), the Electronic Design Automation Consortium (EDA
Consortium), and the Institute of Electrical and Electronics Engineers
(IEEE), and is supported by ACM's Special Interest Group on Design
Automation (ACM SIGDA).
Design Automation Conference acknowledges trademarks or registered
trademarks of other organizations for their respective products and
services.
# # #
For more information, please contact:
Michelle Clancy
Press@dac.com or call 1-303-530-4334
Louisville, Colo. -- January 16, 2014 -- Cliff Hou, PhD, will be a keynote
presenter in June 2014 at the Design Automation Conference (DAC),
the premier conference devoted to the design and
automation of electronic systems. Dr. Hou will discuss how the introduction
of 10nm and 7nm processes will alter today's ecosystem while opening greater
EDA and IP opportunities, and will present new system and chip designs. The
51st DAC will be held at the Moscone Convention Center in San Francisco,
California from June 1-5, 2014.
Dr. Hou will highlight how continued chip- and wafer-based scaling will
deliver the power and performance necessary to deliver wondrous new
applications. A grand alliance of design ecosystem, equipment and material
suppliers will result in production at 10nm and heterogeneous silicon
integration that combines chips from multiple process technologies with 3D
packaging to deliver compelling economics for a "System in a Si Superchip."
He will discuss the new design techniques and system and chip design
challenges likely to be faced by the electronics design and supply
ecosystem, outlining the need for even greater levels of collaboration and
cooperation.
"Industry Opportunities in the Sub-10nm Era" will be presented at 3:00pm on
Monday, June 2, 2014 at DAC.
Along with exciting keynotes, DAC 2014 will feature three new tracks
focused on automotive, Intellectual Property (IP) and security, while
keeping the tradition of offering the best-in-class solutions that promise
to advance electronic design automation (EDA) and embedded systems and
software (ESS).
As the primary venue for the design and automation of electronic systems,
DAC offers outstanding training, education, exhibits and superb networking
opportunities for designers, researchers, tool developers and vendors. For
more information visit www.dac.com
About Dr. Hou
Dr. Cliff Hou was appointed in 2011 as TSMC's Vice President of R&D. He
joined TSMC in 1997. He was previously a Senior Director for Design and
Technology Platform, where he established the company's technology design
kit. He also led TSMC's in-house IP development teams from 2008 to 2010.
Before TSMC, Dr. Hou was with Taiwan's national telecommunications
laboratory, ITRI/CCL, where he workedin front-end design environment
development and as a consultant specializing in physical verification
methodologies. Dr. Hou served as an Associate Professor at Kaohsiung
Polytechnic Institute in Taiwan.
Dr. Hou holds 20 U.S. Patents and serves as a board member of Global Unichip
Corp. He received his B.S. degree in control engineering from Taiwan's
National Chiao-Tung University, and Ph.D. in electrical and computer
engineering from Syracuse University.
About DAC
The Design Automation Conference (DAC) is recognized as the premier event
for the design of electronic circuits and systems and for electronic design
automation (EDA) and silicon solutions. Since 1964, a diverse worldwide
community of many thousands of professionals has attended DAC. They include
system designers and architects, logic and circuit designers, validation
engineers, CAD managers, senior managers and executives as well as
researchers and academicians from leading universities. Close to 60
technical sessions selected by a committee of electronic design experts
offer information on recent developments and trends, management practices
and new products, and methodologies and technologies. A highlight of DAC is
its exhibition and suite area featuring leading and emerging EDA, silicon,
intellectual property (IP) automotive, security and design services
providers. The conference is sponsored by the Association for Computing
Machinery (ACM), the Electronic Design Automation Consortium (EDA
Consortium), and the Institute of Electrical and Electronics Engineers
(IEEE), and is supported by ACM's Special Interest Group on Design
Automation (ACM SIGDA).
Design Automation Conference acknowledges trademarks or registered
trademarks of other organizations for their respective products and
services.
# # #
For more information, please contact:
Michelle Clancy
Press@dac.com or call 1-303-530-4334