Cu-Cu hybrid bonding, BESI or a Korean company?

[NY_Sam2]

Cu-Cu hybrid bonding, BESI or a Korean company?
. leader, BESI (Netherlands)
. followers, Hanwha Semitech (Korea) for SK Hynix, collaboration with Prodrive Technlogies (Netherlands), SEMES (Korea) for Samsung

source = https://www.thelec.kr/news/articleView.html?idxno=53997

 

[Fred Chen]

There have been reports, maybe rumors, that ASML would be entering this space as well?

 

[freshshine1]

There have been reports, maybe rumors, that ASML would be entering this space as well?

I thought I heard something similar too not too long ago.

The Dutch company is looking to grow beyond its EUV roots and plans to expand into the market to make tools that can help glue and connect multiple specialized chips, called advanced packaging - a key building block for AI chips and the advanced memory that feeds them. As part of those plans, the company will deploy AI in its forthcoming businesses and legacy efforts.

"We look, not just for the next five years, we look at the next 10, maybe 15 years," ASML Chief Technology Officer Marco Pieters told Reuters. "(We look at) what are potential directions the industry could take, and what would it require in terms of packaging, bonding, etc.?"

https://semiwiki.com/forum/threads/...-of-chipmaking-tools-for-ai-beyond-euv.24676/

Only other recent sources I could find at the moment all reference to this Korean article.
ASML Moves Into Advanced Packaging With Hybrid Bonding Tool Development