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Buzz about Samsung S9 in 2018 with EUV produced N7 chip:
Samsung Galaxy S9 to use new 7nm chips in 2018 – report
Samsung Galaxy S9 to use new 7nm chips in 2018 – report
ASML Q4 results and 2017 outlook: 2016record sales/income and 18 EUV tools in backlog
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Another Korean article which goes deeper indicates they still have some ways to go, only confirming tool order, not production readiness: 키뉴스 모바일 사이트, [컨콜] 삼성전자, 올해 EUV 투자 원년
Samsung will be presenting at SPIE next month, we will know more then. Scott and I will both be there:
Progress in EUV lithography toward manufacturing (Keynote Presentation)
Paper 10143-2
Author(s): Seong-Sue Kim, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Conference Detail for Extreme Ultraviolet (EUV) Lithography VIII
Progress in EUV lithography toward manufacturing (Keynote Presentation)
Paper 10143-2
Author(s): Seong-Sue Kim, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Conference Detail for Extreme Ultraviolet (EUV) Lithography VIII
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To me, besides the 2 keynotes by SAMSUNG and INTEL (with their 7nm EUV pilot plant coming online in 2017-2018:
Intel pursues Moore's Law with plan to make 7-nm chips this year | Computerworld
The pilot plant will test and iron out kinks in manufacturing 7-nm chips. Intel hasn't said when it'll start shipping 7-nm chips in volume, but it won't be in the next two to three years.)
Session 5 on (EUV) Integration (chaired by ASML Benschop and IBM's Dan Corliss, once described by a Street analyst as a `con` ASML & IBM -Investors Still Don't Get it - What Really Happened I guess there is hope also in the world of 'cons' ) looks very interesting too;
Chris Mack (besides his Tutorial on Stochastics and the phenomenon of line-edge roughness) is also on papers with GlobalFoundries. So, it seems the former IBM people at GF are moving ahead with 7 nm EUV quite forcefully (?), see also here:
>> Advancing toward 7nm
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Intel to Spend $7 Billion on Arizona Fab Analysts speculate Fab 42 for EUV
MADISON, Wis. – Intel Corp. Chief Executive Officer Brian Krzanich went to Washington Wednesday and stood beside President Donald Trump in the Oval Office to announce the company’s $7 billion investment in a semiconductor fab, known as Fab 42, in Arizona.
Fab 42 had stood vacant and unequipped in Chandler, Ariz. since the shell was completed at the end of 2013.
Not for the capacity
Nathan Brookwood, Principal at Insight-64, told EE Times he was surprised by the news. He noted that “Intel is reactivating Fab 42 — probably not for the capacity, but for bringing EUV equipment necessary for 7nm manufacturing.”Rob Lineback, senior market research analyst at IC Insights, also agrees. He believes Fab 42 is where EUV lithography tools will go. “Availability of EUV lithography tools and processes will help make 7nm successful, but this exposure technology represents a major change.” Noting that Intel is still putting the target three to four years out for Fab 42 to be “completed,” Lineback said, “Intel is rightly so being cautious.”
Intel to Spend $7 Billion on Arizona Fab | EE Times
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MADISON, Wis. – Intel Corp. Chief Executive Officer Brian Krzanich went to Washington Wednesday and stood beside President Donald Trump in the Oval Office to announce the company’s $7 billion investment in a semiconductor fab, known as Fab 42, in Arizona.
Fab 42 had stood vacant and unequipped in Chandler, Ariz. since the shell was completed at the end of 2013.
Not for the capacity
Nathan Brookwood, Principal at Insight-64, told EE Times he was surprised by the news. He noted that “Intel is reactivating Fab 42 — probably not for the capacity, but for bringing EUV equipment necessary for 7nm manufacturing.”Rob Lineback, senior market research analyst at IC Insights, also agrees. He believes Fab 42 is where EUV lithography tools will go. “Availability of EUV lithography tools and processes will help make 7nm successful, but this exposure technology represents a major change.” Noting that Intel is still putting the target three to four years out for Fab 42 to be “completed,” Lineback said, “Intel is rightly so being cautious.”
Intel to Spend $7 Billion on Arizona Fab | EE Times
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However, Intel said they still haven't committed to EUV.
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In 2012 INTEL bought ASML shares for EUR 39.91 (see below). The total stake bought by INTEL was EUR 2,513 million. Today the ASML stock is about Euro 116. This means that (assuming INTEL still has the 15% stake) their investment in ASML has returned a profit of ((116-39.91)/39.91)*2.513 = 4.8 B Euro. I guess that will pay (if needed) for some of the investment, may INTEL decide to slowly reduce their stake in ASML over the next 2-3 years while FAB 42 gets
loaded with (EUV) equipment. At >100 MEuro a piece, INTEL can afford buying some >40 NXE3400 EUV tools, paid for by ASML investors...Not a bad 'shared pain, shared gain'.....
ASML: Investors - Customer Co-Investment Program
Investment Agreements
Pursuant to the investment agreement between ASML and Intel, dated July 9, 2012 ("the Intel Investment Agreement"), ASML has issued and delivered to Intel Stichting ordinary shares equal to 15 percent of the issued ordinary shares with simultaneous issuance by the Intel Stichting to Intel of the corresponding depositary receipts.
Pursuant to the investment agreement between ASML and TSMC, dated August 5, 2012 (the "TSMC Investment Agreement") ASML has issued and delivered to Stichting Administratiekantoor TSMC ("TSMC Stichting") ordinary shares equal to 5 percent of the issued ordinary shares with simultaneous issuance by the TSMC Stichting to TSMC of the corresponding depositary receipts.
Pursuant to the investment agreement between ASML and Samsung, dated August 27, 2012 (the "Samsung Investment Agreement" and together with the Intel Investment Agreement and TSMC Investment Agreement, the "Investment Agreements"), ASML has issued and delivered to the Samsung Stichting ordinary shares equal to 3 percent of the issued ordinary shares with simultaneous issuance by the Samsung Stichting to Samsung of the corresponding depositary receipts.
The subscription price for the ordinary shares under the Investment Agreements was EUR 39.91 per ordinary share, which is the average of the volume weighted average price of the ordinary shares on NYSE Euronext Amsterdam for the twenty trading days up to and including July 6, 2012.
Based upon the subscription price (EUR 39.91) included in the Investment Agreements, the equity participation of Intel (15 percent), TSMC (5 percent) and Samsung (3 percent) amount to EUR 2,513 million, EUR 838 million and EUR 503 million, respectively.
User nl
loaded with (EUV) equipment. At >100 MEuro a piece, INTEL can afford buying some >40 NXE3400 EUV tools, paid for by ASML investors...Not a bad 'shared pain, shared gain'.....
ASML: Investors - Customer Co-Investment Program
Investment Agreements
Pursuant to the investment agreement between ASML and Intel, dated July 9, 2012 ("the Intel Investment Agreement"), ASML has issued and delivered to Intel Stichting ordinary shares equal to 15 percent of the issued ordinary shares with simultaneous issuance by the Intel Stichting to Intel of the corresponding depositary receipts.
Pursuant to the investment agreement between ASML and TSMC, dated August 5, 2012 (the "TSMC Investment Agreement") ASML has issued and delivered to Stichting Administratiekantoor TSMC ("TSMC Stichting") ordinary shares equal to 5 percent of the issued ordinary shares with simultaneous issuance by the TSMC Stichting to TSMC of the corresponding depositary receipts.
Pursuant to the investment agreement between ASML and Samsung, dated August 27, 2012 (the "Samsung Investment Agreement" and together with the Intel Investment Agreement and TSMC Investment Agreement, the "Investment Agreements"), ASML has issued and delivered to the Samsung Stichting ordinary shares equal to 3 percent of the issued ordinary shares with simultaneous issuance by the Samsung Stichting to Samsung of the corresponding depositary receipts.
The subscription price for the ordinary shares under the Investment Agreements was EUR 39.91 per ordinary share, which is the average of the volume weighted average price of the ordinary shares on NYSE Euronext Amsterdam for the twenty trading days up to and including July 6, 2012.
Based upon the subscription price (EUR 39.91) included in the Investment Agreements, the equity participation of Intel (15 percent), TSMC (5 percent) and Samsung (3 percent) amount to EUR 2,513 million, EUR 838 million and EUR 503 million, respectively.
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