Sharretts Plating Company (SPC) is building internal capability in wafer-level metallization, with a focus on electrochemical deposition processes for semiconductor and microelectronic applications.
To support this effort, SPC has engaged John Ghekiere, a semiconductor industry veteran with over two decades of experience in wafer fabrication equipment and process development.
Mr. Ghekiere has held technical and leadership roles spanning:
* Interconnect electroplating
* Wafer-level packaging processes
* Single-wafer and batch surface preparation systems
He has been directly involved in the development of electrochemical metallization platforms and process architectures used in compound semiconductor and advanced packaging environments.
From a process standpoint, wafer-level electroplating remains an enabling technology for metallization due to its cost efficiency and flexibility, but achieving uniform, high-quality deposition requires careful control of electric field distribution and fluid dynamics at the wafer surface.
SPC’s initiative is focused on translating these established semiconductor process principles into a controlled development environment capable of supporting:
* Wafer-level electroplating
* Electroless metallization
* Surface preparation for difficult substrates
* Process integration for advanced packaging and microelectronic applications
The objective is not to replicate high-volume fab infrastructure, but to establish a flexible, application-focused capability aligned with “More-than-Moore” use cases, including sensors, specialty devices, and emerging interconnect architectures.
Mr. Ghekiere’s role will center on process development, capability definition, and bridging execution gaps between semiconductor-grade metallization requirements and available commercial solutions.
Additional background and context are available here:
To support this effort, SPC has engaged John Ghekiere, a semiconductor industry veteran with over two decades of experience in wafer fabrication equipment and process development.
Mr. Ghekiere has held technical and leadership roles spanning:
* Interconnect electroplating
* Wafer-level packaging processes
* Single-wafer and batch surface preparation systems
He has been directly involved in the development of electrochemical metallization platforms and process architectures used in compound semiconductor and advanced packaging environments.
From a process standpoint, wafer-level electroplating remains an enabling technology for metallization due to its cost efficiency and flexibility, but achieving uniform, high-quality deposition requires careful control of electric field distribution and fluid dynamics at the wafer surface.
SPC’s initiative is focused on translating these established semiconductor process principles into a controlled development environment capable of supporting:
* Wafer-level electroplating
* Electroless metallization
* Surface preparation for difficult substrates
* Process integration for advanced packaging and microelectronic applications
The objective is not to replicate high-volume fab infrastructure, but to establish a flexible, application-focused capability aligned with “More-than-Moore” use cases, including sensors, specialty devices, and emerging interconnect architectures.
Mr. Ghekiere’s role will center on process development, capability definition, and bridging execution gaps between semiconductor-grade metallization requirements and available commercial solutions.
Additional background and context are available here: