2024-05-20 05:20 Economic Daily/ReporterYin Huizhong,Su Jiawei/Taipei ReportTSMC
TSMC. Reuters
Apple rushes into AI , high-level executives secretly visit TSMC . It is reported in the industry that Apple Chief Operating Officer Jeff Williams recently visited Taiwan Semiconductor Manufacturing Co., Ltd. (2330) in a low-key manner. TSMC President Wei Zhejia personally received the reception. Both parties will focus on Apple’s development of self-developed AI chips and will contract with TSMC’s advanced process production capacity to produce related chips. , adding strong momentum to TSMC’s order intake.
Apple did not immediately respond to reporters' inquiries. TSMC has always not commented on market rumors or single customer information, and it did not comment on yesterday (19th).
According to legal analysis, Apple’s active development of innovative applications requires more support from the latest semiconductor technology. It has previously taken the lead in contracting TSMC’s first batch of 3nm production capacity. If it subsequently orders the first batch of 2nm or even more advanced process production capacity, Apple’s contribution is expected to be TSMC's annual revenue and output will steadily reach highs. This year, it has the opportunity to reach NT$600 billion, a new high. It will challenge the long-term challenge of reaching trillions of dollars and write a new milestone.
Regarding data center investment, Apple Chief Financial Officer Luca Maestri bluntly stated at the financial report conference recently that he has his own data center in this field and also uses third parties. This model has worked well and the plan continues to advance. He also mentioned that he is excited about the business opportunities of generative AI, and the company has invested more than US$100 billion in related research and development in the past five years.
It is understood that Apple has cooperated with TSMC for many years in addition to the A-series processors used in iPhones. In recent years, Apple has launched a long-term plan for Apple silicon to create M-series processors for MacBooks and iPads. The key driver is Williams. This time Williams He came to Taiwan to discuss a new wave of package production capacity and cooperation with TSMC for Apple's self-developed AI chips, which attracted special attention from the industry.
The M-series processors have successfully taken the market by storm. Apple has successively converted Intel processors in the Mac series product line to its own M-series chips starting from the end of 2020. This successful model allows Apple to focus on designing and developing more competitive products. Currently, it is developing its own AI chips for its own data center servers. It is rumored that it aims to optimize the performance of some of the existing Huida architecture data center chips.
Apple has begun to enter the AI server side, using the Arm architecture to create a self-developed AI computing processor in a semi-customized form. In addition to using TSMC's advanced process for mass production, due to the high computing performance of the AI server It will affect the computing power. It will be built with TSMC's SoIC advanced packaging process, which has the highest production cost, and the processor will be integrated in a 3D stacking method. However, due to the high cost, Apple should not have plans to expand to terminal devices in the short term.
However, in response to the booming development of new generative AI technologies, in addition to the substantial increase in cloud computing demand, terminal devices have also begun to have edge computing needs. Apple has followed the related trend, especially in the M4 system single chip built with TSMC's 3nm process. The chip (Chiplet) integrates a more powerful neural network engine (Neural Network). Although the integration method is similar to the previous generation, the computing speed is expected to be doubled.
Next, Apple will develop three different levels of M4 processors codenamed Donan, Brava, and Hidra to fully seize the AI PC business opportunities. It is expected to enter the mass production stage at TSMC in the second half of this year, and will be sealed by ASE Investment Control. Measurement.
udn.com
Apple rushes into AI , high-level executives secretly visit TSMC . It is reported in the industry that Apple Chief Operating Officer Jeff Williams recently visited Taiwan Semiconductor Manufacturing Co., Ltd. (2330) in a low-key manner. TSMC President Wei Zhejia personally received the reception. Both parties will focus on Apple’s development of self-developed AI chips and will contract with TSMC’s advanced process production capacity to produce related chips. , adding strong momentum to TSMC’s order intake.
Apple did not immediately respond to reporters' inquiries. TSMC has always not commented on market rumors or single customer information, and it did not comment on yesterday (19th).
According to legal analysis, Apple’s active development of innovative applications requires more support from the latest semiconductor technology. It has previously taken the lead in contracting TSMC’s first batch of 3nm production capacity. If it subsequently orders the first batch of 2nm or even more advanced process production capacity, Apple’s contribution is expected to be TSMC's annual revenue and output will steadily reach highs. This year, it has the opportunity to reach NT$600 billion, a new high. It will challenge the long-term challenge of reaching trillions of dollars and write a new milestone.
Regarding data center investment, Apple Chief Financial Officer Luca Maestri bluntly stated at the financial report conference recently that he has his own data center in this field and also uses third parties. This model has worked well and the plan continues to advance. He also mentioned that he is excited about the business opportunities of generative AI, and the company has invested more than US$100 billion in related research and development in the past five years.
It is understood that Apple has cooperated with TSMC for many years in addition to the A-series processors used in iPhones. In recent years, Apple has launched a long-term plan for Apple silicon to create M-series processors for MacBooks and iPads. The key driver is Williams. This time Williams He came to Taiwan to discuss a new wave of package production capacity and cooperation with TSMC for Apple's self-developed AI chips, which attracted special attention from the industry.
The M-series processors have successfully taken the market by storm. Apple has successively converted Intel processors in the Mac series product line to its own M-series chips starting from the end of 2020. This successful model allows Apple to focus on designing and developing more competitive products. Currently, it is developing its own AI chips for its own data center servers. It is rumored that it aims to optimize the performance of some of the existing Huida architecture data center chips.
Apple has begun to enter the AI server side, using the Arm architecture to create a self-developed AI computing processor in a semi-customized form. In addition to using TSMC's advanced process for mass production, due to the high computing performance of the AI server It will affect the computing power. It will be built with TSMC's SoIC advanced packaging process, which has the highest production cost, and the processor will be integrated in a 3D stacking method. However, due to the high cost, Apple should not have plans to expand to terminal devices in the short term.
However, in response to the booming development of new generative AI technologies, in addition to the substantial increase in cloud computing demand, terminal devices have also begun to have edge computing needs. Apple has followed the related trend, especially in the M4 system single chip built with TSMC's 3nm process. The chip (Chiplet) integrates a more powerful neural network engine (Neural Network). Although the integration method is similar to the previous generation, the computing speed is expected to be doubled.
Next, Apple will develop three different levels of M4 processors codenamed Donan, Brava, and Hidra to fully seize the AI PC business opportunities. It is expected to enter the mass production stage at TSMC in the second half of this year, and will be sealed by ASE Investment Control. Measurement.
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