May 29, 2025
Plano, Texas, USA
Mosaic Microsystems and NHanced Semiconductor are latest to join Siemens’ OSAT Alliance initiative to build secure domestic semiconductor industry in the USA
The OSAT Alliance helps mutual customers to fully leverage the integrated workflow across Siemens’ EDA portfolio (including Calibre® software, Innovator3D IC™ software, HyperLynx™ software and Xpedition™ Package Designer software) and encourage selected supply-chain partners to develop design flows and assembly design kits (ADKs) so that their customers can design, verify and validate efficiently and predictably for the partners’ advanced semiconductor integration platforms and technologies
“The OSAT Alliance has been designed to help promote the adoption and growth of advanced semiconductor packaging throughout the industry’s ecosystem and enable system and fabless semiconductor companies to have a friction-free path to emerging packaging technologies,” said AJ Incorvaia, senior vice president and general manager, Electronic Board Systems Division, Siemens Digital Industries Software. “We welcome Mosaic Microsystems and Nhanced Semiconductors and look forward to them joining us on this journey towards a secure domestic semiconductor supply chain in the USA.”
Mosaic Microsystems, headquartered in Rochester NY, will use Siemens‘ EDA technologies to develop ADKs for its thin glass substrate technology for a range of microelectronics applications, photonics, RF/mmWave, MEMS and sensor technologies.
Image courtesy of Mosaic Microsystems
“Joining the OSAT Alliance is a significant step for Mosaic Microsystems as we continue to drive innovation in high-density advanced packaging. Integrating our unique thin glass technology with Siemens' comprehensive EDA portfolio, alongside the expertise of other alliance members, will unlock new possibilities for our customers,” said Chris Mann, Vice President of Business Development, Mosaic Microsystems. “The development of standardized design flows and ADKs will be instrumental in streamlining the design and assembly process, allowing for more predictable and high-performance outcomes with our advanced substrates."
Image courtesy of NHanced Semiconductor Inc.
NHanced Semiconductors in Morrisville NC and Odon, Indiana will employ Siemens EDA technologies to develop ADKs for their silicon interposer-based technology which targets the industrial, medical, military and scientific industry segments.
“Our membership in the Siemens OSAT Alliance provides our customers with a comprehensive software suite to implement superior heterogeneous integration and advanced packaging designs,” said Robert Patti, president, NHanced Semiconductors. “It also expands the benefits of our Foundry 2.0 business model, which integrates best-of-class dies and chiplets from traditional foundries into novel assemblies. The OSAT Alliance is a critical asset in re-shoring advanced packaging to the US.”
For more information about how Mosaic Microsystems and NHanced Semiconductors have joined Siemens, ASE, Amkor and DECA Technologies in the OSAT Alliance program, visit https://eda.sw.siemens.com/en-US/ic-packaging/osat-alliance/
Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens' software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today's ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.
Note: A list of relevant Siemens trademarks can be found here. Other trademarks belong to their respective owners.
Email: press.software.sisw@siemens.com
Link to Press Release
Plano, Texas, USA
Mosaic Microsystems and NHanced Semiconductor are latest to join Siemens’ OSAT Alliance initiative to build secure domestic semiconductor industry in the USA
- - Mosaic Microsystems and NHanced Semiconductors are latest to join Siemens’ initiative to build secure domestic semiconductor industry in the USA
The OSAT Alliance helps mutual customers to fully leverage the integrated workflow across Siemens’ EDA portfolio (including Calibre® software, Innovator3D IC™ software, HyperLynx™ software and Xpedition™ Package Designer software) and encourage selected supply-chain partners to develop design flows and assembly design kits (ADKs) so that their customers can design, verify and validate efficiently and predictably for the partners’ advanced semiconductor integration platforms and technologies
“The OSAT Alliance has been designed to help promote the adoption and growth of advanced semiconductor packaging throughout the industry’s ecosystem and enable system and fabless semiconductor companies to have a friction-free path to emerging packaging technologies,” said AJ Incorvaia, senior vice president and general manager, Electronic Board Systems Division, Siemens Digital Industries Software. “We welcome Mosaic Microsystems and Nhanced Semiconductors and look forward to them joining us on this journey towards a secure domestic semiconductor supply chain in the USA.”
Mosaic Microsystems, headquartered in Rochester NY, will use Siemens‘ EDA technologies to develop ADKs for its thin glass substrate technology for a range of microelectronics applications, photonics, RF/mmWave, MEMS and sensor technologies.
Image courtesy of Mosaic Microsystems
“Joining the OSAT Alliance is a significant step for Mosaic Microsystems as we continue to drive innovation in high-density advanced packaging. Integrating our unique thin glass technology with Siemens' comprehensive EDA portfolio, alongside the expertise of other alliance members, will unlock new possibilities for our customers,” said Chris Mann, Vice President of Business Development, Mosaic Microsystems. “The development of standardized design flows and ADKs will be instrumental in streamlining the design and assembly process, allowing for more predictable and high-performance outcomes with our advanced substrates."
Image courtesy of NHanced Semiconductor Inc.
NHanced Semiconductors in Morrisville NC and Odon, Indiana will employ Siemens EDA technologies to develop ADKs for their silicon interposer-based technology which targets the industrial, medical, military and scientific industry segments.
“Our membership in the Siemens OSAT Alliance provides our customers with a comprehensive software suite to implement superior heterogeneous integration and advanced packaging designs,” said Robert Patti, president, NHanced Semiconductors. “It also expands the benefits of our Foundry 2.0 business model, which integrates best-of-class dies and chiplets from traditional foundries into novel assemblies. The OSAT Alliance is a critical asset in re-shoring advanced packaging to the US.”
For more information about how Mosaic Microsystems and NHanced Semiconductors have joined Siemens, ASE, Amkor and DECA Technologies in the OSAT Alliance program, visit https://eda.sw.siemens.com/en-US/ic-packaging/osat-alliance/
Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens' software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today's ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries. Siemens Digital Industries Software – Accelerating transformation.
Note: A list of relevant Siemens trademarks can be found here. Other trademarks belong to their respective owners.
Contacts for Press
Siemens Digital Industries Software PR TeamEmail: press.software.sisw@siemens.com
Link to Press Release