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The Tongluo fab is not DRAM: https://evertiq.com/news/55663
PSMC started construction of the USD 9.72 billion fab in 2021 in order to ramp up its output of mature chips with 28-nanometer, 45-nanometer and 50-nanometer technologies. The fab capacity is scheduled at 50,000 12-inch wafers per...
This statement is telling:
"The feedback from our colleagues, our suppliers and our customers shows that our ways of working have, in some cases, become less agile. Engineers in particular have expressed their desire to focus their time on engineering, without being hampered by slow process...
A Photomask Japan 2025 paper by Intel's Mask group pointed out that High-NA would bring more sensitivity to smaller defects, creating new challenges for detection and repair. In particular,
"High-NA EUV reticle repair has been challenging due to more precise edge control requirements...
By Anton Shilov published January 23, 2026
Intel still has zero committed external customers for 14A.
Two potential customers are currently exploring test chips made on Intel's 14A fabrication process, Intel disclosed as part of its earnings call this week.
The company said that there will be...
The temptation has been there for very long.
As Lai Ching-Te said, "Once Taiwan is annexed, China will gain greater strength to compete with the United States on the international stage, undermining the rules-based international order."...
Judy Lin 林昭儀
Jan 27, 2026
Executive Summary: The “System-Level Foundry” Shift
Understanding TSMC’s current Intellectual Property (IP) layout is critical because it reveals a fundamental transformation: TSMC is no longer just shrinking transistors; it is architecting an integrated AI...
Yes, pellicles have been taken for granted with DUV (<$1000). The one in the article is >$40,000.
"The economics around pellicles have encouraged divergent approaches. DUV pellicles are relatively inexpensive, at about $720, which has enabled their widespread use in earlier nodes. However, EUV...
TSMC is actually making its own, rather than relying on Mitsui: https://semiwiki.com/forum/threads/tsmc-repurposing-old-fabs-to-bring-euv-pellicle-production-in-house.23593/
Date : 2026-01-22 10:04
Samsung Electronics will introduce the 'extreme ultraviolet (EUV) pellicle', a key component that will increase the productivity of advanced semiconductor processes, for the first time at the Taylor fab being built in the United States. Until now, it was unclear whether...
LBT: We are now shipping our first products built on Intel 18A – the most advanced semiconductor process developed and manufactured on U.S. soil. As stated earlier, yields continue to improve steadily as we work to ramp the supply needed to meet strong customer demand.
"We are seeing significant progress being made on foundry, with 18A yields improving to over 60% and good enough to ramp Panther Lake," Vinh and Rosumny said. "While not best in class, as TSMC (TSM) was at 70-80% when it launched 2nm, with INTC's aspirations of being the #2 foundry supplier...
I thought the column headings were the respective conference paper references.
N3E is a looser track pitch than N3B, with a 169 nm cell height, but it's still denser than N5P 210 nm.
I could not find the reference to "execution challenges", but it seems a couple of reasons Samsung would be currently preferred over Intel are Samsung is already well-known (though maybe not entirely favorably) in foundry world as a TSMC alternative, and people are waiting to see how Panther...
Muhammad Zuhair Jan 19, 2026 at 11:59am EST
Samsung's chip operations in the US are now gaining the spotlight, as a report reveals the Korean giant is attracting massive interest from fabless customers.
Samsung's Prior Commitments With the Likes of NVIDIA & Apple Gives Them a Massive Edge Over...
Intel will reserve and likely use the option not to use 0.55NA for 14A: depth of focus, resist blur, mask challenges (https://www.spiedigitallibrary.org/conference-proceedings-of-spie/13655/136550G/Intel-is-paving-the-way-to-state-of-the-art/10.1117/12.3075863.full).
