Array
(
    [content] => 
    [params] => Array
        (
            [0] => /forum/search/310888/?c%5Busers%5D=Fred+Chen&o=date&page=2
        )

    [addOns] => Array
        (
            [DL6/MLTP] => 13
            [Hampel/TimeZoneDebug] => 1000070
            [SV/ChangePostDate] => 2010200
            [SemiWiki/Newsletter] => 1000010
            [SemiWiki/WPMenu] => 1000010
            [SemiWiki/XPressExtend] => 1000010
            [ThemeHouse/XLink] => 1000970
            [ThemeHouse/XPress] => 1010570
            [XF] => 2030770
            [XFI] => 1060170
        )

    [wordpress] => /var/www/html
)

Search results

  1. F

    Chinese media given tour of Intel Fab 52: here are their notes

    Another informal discussion with some more small fab details revealed by some Americans on the tour:
  2. F

    Chinese media given tour of Intel Fab 52: here are their notes

    (continued) Unfortunately, as I'm sure everyone can understand, taking photos or videos is not allowed inside Intel's wafer factory. Here I can only share some photos and videos provided by Intel officials and briefly talk to you about your impressions. This time we visited Fab 42 and...
  3. F

    Chinese media given tour of Intel Fab 52: here are their notes

    In August 2023, Fast Technology was one of only four Chinese media outlets to visit Intel's packaging and testing factory and laboratory in Malaysia , and gained an early understanding of the architectural design and technical features of the new Core Ultra (Meteor Lake) processor. Recently...
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    Zhang Pingan: 5nm and 7nm are not the core. Huawei's computing power is already three times that of Nvidia chips.

    According to Fast Technology on October 4, in the view of Zhang Pingan, Huawei's executive director and CEO of Huawei Cloud, chip process is not the core, what customers really need is high-quality computing results. Recently, Zhang Pingan publicly stated that Huawei Cloud Service has achieved...
  5. F

    Intel Unveils Panther Lake Architecture: First AI PC Platform Built on 18A

    Going by 0.2 at Q1'25, I would have added 0.02 to the estimates afterwards: Q2'25: 0.17 Q3'25: 0.15 Q4'25-Q1'26: 0.13 But 0.15 still gets ~87% for 100 mm2 die
  6. F

    China expands rare earths restrictions, targets defense and chips users

    BEIJING, Oct 9 (Reuters) - China dramatically expanded its rare earths export controls on Thursday, adding five new elements and extra scrutiny for semiconductor users as Beijing tightens control over the sector ahead of talks between Presidents Donald Trump and Xi Jinping. The world's largest...
  7. F

    Intel Unveils Panther Lake Architecture: First AI PC Platform Built on 18A

    Well, maybe 18A yield doesn't need press interpretation, Intel presented D0 trend chart here: https://www.tomshardware.com/pc-components/cpus/intels-18a-production-starts-before-tsmcs-competing-n2-tech-heres-how-the-two-process-nodes-compare In Q3 2024, D0 was said to be 0.4...
  8. F

    The U.S.-China rare earths gambit: Who blinks first?

    China dramatically expanded its rare earths export controls on Thursday, adding five new elements and extra scrutiny for semiconductor users as Beijing tightens control over the sector ahead of talks between Presidents Donald Trump and Xi Jinping. The world's largest rare earths producer also...
  9. F

    China blacklists researchers that exposed Huawei chip secrets

    How does this test site work? It claims blocked URLs for entities which have provided information to China.
  10. F

    The HBF battle is underway, with Samsung reportedly joining the challenge against SK Hynix and Kioxia.

    Agreed, the power outage is not a driving reason. Probably the main driver is the much larger capacity, and also savings from no refresh. The endurance and latency are still drawbacks, so HBM cannot be completely replaced.
  11. F

    The HBF battle is underway, with Samsung reportedly joining the challenge against SK Hynix and Kioxia.

    Sandisk targets to deliver first samples of its HBF memory in the second half of calendar 2026 and expects samples of the first AI-inference devices with HBF to be available in early 2027...
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    The HBF battle is underway, with Samsung reportedly joining the challenge against SK Hynix and Kioxia.

    By Su Ziyun | Published October 2, 2025, 5:15 PM According to Korean media reports, Samsung Electronics has begun the conceptual design and early development of high-bandwidth flash memory (HBF) products, preparing to join a new round of battle in the memory market. HBF's design concept is...
  13. F

    The U.S.-China rare earths gambit: Who blinks first?

    The impact is greater with the use of rare earths in chips. They are used for work-function tuning in HKMG for example. Or some new memory materials.
  14. F

    The U.S.-China rare earths gambit: Who blinks first?

    August 19, 2025 Junhua Zhang China’s dominance over rare earths gives Beijing powerful leverage in trade, technology and strategic negotiations. In a nutshell - Beijing uses rare earth export controls to pressure the U.S. in trade disputes - U.S. alternatives remain slow, costly and...
  15. F

    TechInsights Teardown: Huawei Ascend 910c Still Contains CPU Dies from TSMC from 2020

    Since Ascend 910C is using 7nm, does it mean the 5nm stockpile has run out?
  16. F

    ARM CEO Rene Haas Claims That Time Has Punished Intel For Falling Behind the Chip Race

    The EUV argument starting 12:20 falls apart when you consider Samsung. I was also surprised by his characterization of US perception of manufacturing as a non-prestigious "blue-collar job" 17:40.
  17. F

    Tenstorrent in talks with TSMC, Samsung, even Rapidus, for 2nm; Jim Keller considering working with Intel

    AI chip design startup, Tenstorrent, has announced it's working with a range of companies to build out its next-generation AI chips. These include TSMC, Samsung, and Japanese firm Rapidus, all of which will provide their latest 2nm process nodes to develop future AI hardware. CEO and AMD and...
  18. F

    OpenAI CEO rumored to secure AI chip and server supply in low-key visit to Taiwan

    We can expect about half that die size (~35 mm2), so we can expect about half that many wafers/month.
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