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  1. F

    TSMC Reports Second Quarter Revenue Increased 44.4% Year-Over-Year

    They're using N7 fab capacity for supporting N5, amazing. N5 and N3 capacity very tight, obviously.
  2. F

    Intel’s Pivot: Why It’s Betting on UMC—Not TSMC—in the Legacy Node Wars

    These two nodes seem quite similar, unless the TSMC-like naming threw me off. TSMC puts 12 and 16 in the same family: https://www.tsmc.com/english/dedicatedFoundry/technology/logic/l_16_12nm MediaTek is already an Intel 16 customer.
  3. F

    The United States' NSTC EUV Accelerator is coming to Albany

    Intel already had more EUV resources.
  4. F

    Why Samsung is losing its top talent to SK hynix

    The practice of internal competition (where losing side is not penalized) is good.
  5. F

    Why Samsung is losing its top talent to SK hynix

    A rigid hierarchy and risk-averse culture are driving a quiet exodus from Korea's chip giant By Hwang Min-gyu, Choi Ji-hee, Chun Byung-soo, Park Su-hyeon, Yu Jung-in Published 2025.07.15. 14:01Updated 2025.07.15. 17:49 After a decade overseeing DRAM processes at Samsung Electronics, a...
  6. F

    Huawei, the leader in Chinese semiconductor development… ‘Life or death’ for SMIC 5nm mass production next year

    The parametric yield also matters.
  7. F

    Huawei, the leader in Chinese semiconductor development… ‘Life or death’ for SMIC 5nm mass production next year

    It hasn't been clear if it's SMIC doing the fabbing for Huawei or Huawei has their own fab. Either way, any subsidy for low yield must go to Huawei, it seems. SiCarrier is just another vying vendor. Another thought I had on this was that Huawei is prioritizing AI chip development over foundry...
  8. F

    Huawei, the leader in Chinese semiconductor development… ‘Life or death’ for SMIC 5nm mass production next year

    If this low yield is not an excursion, then it looks like it has been subsidized by the Chinese government for a while. So there has been no incentive for optimization or improvement of the process. With the subsidy, in principle nothing would be "impossible" it seems. I discussed a little...
  9. F

    Huawei, the leader in Chinese semiconductor development… ‘Life or death’ for SMIC 5nm mass production next year

    Both SMIC and Huawei each have SAQP patents, e.g., CN110739210, CN112309838, CN117751427, but the techniques they describe are not as efficient as the one from SiCarrier CN117080054. Not-Invented-Here syndrome could make getting to 5nm much harder. It could explain the two-year delay.
  10. F

    IBM Power11 appears 50% denser on the same Samsung 7nm process?

    It looks like they weren't maxing out the transistor density to begin with.
  11. F

    Intel layoffs begin: Chipmaker is cutting many thousands of jobs

    The second group affected consists of technicians working in what is known as the ROC (Remote Operations Center), according to employees at the ROC who spoke to Calcalist. These operations staff remotely control, monitor, and manage production processes. ROC technicians do not physically work on...
  12. F

    Taiwan's No. 2 chipmaker UMC eyes entering cutting-edge race

    Probably 38 nm minimum metal pitch makes most sense (6 tracks 228 nm height). Intel shouldn't have to resort to pitch quartering. Pitch halving should be sufficient.
  13. F

    Exclusive: Intel's new CEO explores big shift in chip manufacturing business

    Since taking the company's helm in March, CEO Lip-Bu Tan has moved fast to cut costs and find a new path to revive the ailing U.S. chipmaker. By June, he started voicing that a manufacturing process that prior CEO Pat Gelsinger bet heavily on, known as 18A, was losing its appeal to new...
  14. F

    Exclusive: Intel's new CEO explores big shift in chip manufacturing business

    Potential write-off for "18A" process could cost hundreds of millions of dollars.
  15. F

    Taiwan's No. 2 chipmaker UMC eyes entering cutting-edge race

    UMC collaborated with IBM before.
  16. F

    If China takes TSM?

    It should have been apparent already with the Hezbollah attacks.
  17. F

    If China takes TSM?

    EUV not so meaningful or not as meaningful as AI chips.
  18. F

    If China takes TSM?

    Recent poll shows support for Taiwan, though I'm not sure about respondent selection. https://www.taipeitimes.com/News/taiwan/archives/2025/06/30/2003839503
  19. F

    Intel 18A Process Node Offers 25% Higher Frequency At ISO & 36% Lower Power At Same Frequency Versus Intel 3, Over 30% Density

    Yes, with Intel 3 M2 being much looser, seems Intel 3 should have been less, if not the same. On the other hand, if 32 nm pitch vs. 30 nm pitch makes that much of a difference, then 32 nm pitch is still on a cliff.
  20. F

    Intel 18A Process Node Offers 25% Higher Frequency At ISO & 36% Lower Power At Same Frequency Versus Intel 3, Over 30% Density

    I read this finally as less single exposure EUV for M0-M2 layers for 18A compared to Intel 3 (?) Power rail pitch should be cell height (160 nm?) so dry DUV could even do that.
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