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Cadence Advances Design and Engineering for Europe’s Manufacturers on NVIDIA Industrial AI Cloud
11 Jun 2025 PARIS— At NVIDIA GTC Paris, Cadence (Nasdaq: CDNS) announced it is providing optimized solutions for the world’s first industrial AI cloud in collaboration with NVIDIA. Customers will be able to accelerate the development of their industrial technology by leveraging Cadence’s... -
“TSMC-UTokyo Lab” Launched to Promote Advanced Semiconductor Research, Education and Talent Incubation
TOKYO, Japan, Jun. 12, 2025 – The University of Tokyo (UTokyo) and TSMC (TWSE: 2330, NYSE: TSM) today announced the opening of the “TSMC-UTokyo Lab”, dedicated to advancing semiconductor research, education and talent incubation. As TSMC’s first joint lab with a university outside Taiwan, it... -
PCI-SIG® Releases PCIe® 7.0 Specification to Support the Bandwidth Demands of Artificial Intelligence at 128.0 GT/s Transfer Rates
SANTA CLARA, Calif.--(BUSINESS WIRE)--PCI-SIG® today announced the official release of the PCI Express® (PCIe®) 7.0 specification, reaching 128.0 GT/s, to members. PCIe 7.0 specification targets data-driven applications like AI/ML, 800G Ethernet, cloud, and Quantum computing. Pathfinding for the... -
proteanTecs Gains Momentum as the Trusted Choice for Lifecycle Monitoring of AI Hardware
Haifa, Israel – June 10, 2025 – proteanTecs, a global leader in deep data monitoring for advanced electronics, is gaining significant traction as the partner of choice for AI chipmakers, delivering a dedicated suite of embedded solutions purpose-built for AI chips across cloud and edge...- AmandaK
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- Forum: ProteanTecs
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Siemens - Calibre seminar at DAC
June 24, 2025 12:00 PM -1:00 PM Moscone West | San Francisco, CA Calibre: Supercharge your chip integration efforts Siemens is excited to host an exclusive event for our customers at the Design Automation Conference Join us at DAC for lunch and learn how our new products can supercharge your...- AmandaK
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- Forum: Siemens EDA
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Cimolai Technology drives heavy equipment industry innovation with Siemens Xcelerator
June 10, 2025 Plano, Texas, USA - Italian leader in custom handling and lifting machinery adopts Siemens’ NX and Teamcenter to drive development of huge machines in marinas and shipyards, infrastructure and heavy industry and foster cross-team collaboration - Cimolai Technology worked with...- AmandaK
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- Forum: Siemens EDA
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Silicon Catalyst Executive Richard Curtin Joins NLET.org as Advisor for Semiconductor Industry
Oakland, CA (June 11, 2025) — NLET.org, the National Laboratory for Education Transformation, today announced the appointment of Richard Curtin, Managing Partner at Silicon Catalyst, as a Senior Advisor for the Semiconductor Industry and AI Sector workgroup. Curtin brings decades of strategic...- AmandaK
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- Forum: Silicon Catalyst
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Synopsys Achieves PCIe 6.x Interoperability Milestone with Broadcom's PEX90000 Series Switch at PCI-SIG DevCon 2025
Demonstration at 64 GT/s Reduces Design Risk and Accelerates Deployment of High-Performance AI and Computing Solutions with Proven PCIe 6.x Technologies SUNNYVALE, Calif., June 11, 2025 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced that its collaboration with Broadcom has... -
sureCore launches comprehensive suite of silicon services Enabling robust, power-efficient design and faster time-to-market
June 10, 2025 SureCore, the leading ultra-low-power memory specialist, has launched a comprehensive suite of silicon services, to help customers developing cutting-edge applications address complex design requirements. Leveraging its extensive experience in low-power and low-voltage design, the... -
Elliptic Labs’ AI Platform Now Optimized for Ceva’s NeuPro-Nano NPU – Enabling Smarter Edge Devices
OSLO, Norway and ROCKVILLE, Md., June 10, 2025 /PRNewswire/ — Elliptic Labs (OSE: ELABS), a global AI software company and the world leader in AI Virtual Smart Sensors™ currently deployed in over half a billion devices, and Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software... -
TSMC Shareholders’ Meeting Resolutions
HSINCHU, Taiwan, R.O.C., June 3, 2025 – TSMC (TWSE: 2330, NYSE: TSM) today held its 2025 Annual Shareholders’ Meeting, which passed the following resolutions: 1. Acknowledged the 2024 Business Report and Financial Statements. Consolidated revenue totaled NT$2,894.31 billion and net income was... -
Keysight and Synopsys Deliver an AI-Powered RF Design Migration Flow for Transition from TSMC’s N6RF+ to N4P Process Node
- Keysight’s Electromagnetic Simulator and Synopsys’ AI-powered RF design migration flow, provide an efficient, integrated radio frequency circuit re-design solution - TSMC’s Analog Design Migration Methodology to accelerate migration of existing TSMC N6RF+ design to the advanced N4P technology... -
Soitec and PSMC collaborate on ultra-thin TLT technology for nm-scale 3D stacking
Bernin (France), June 3, 2025 – Soitec (Euronext – Tech Leaders), a world leader in the design and production of innovative semiconductor materials, today announced a strategic collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC). Under the collaboration, Soitec will... -
Silvaco To Present at the Rosenblatt 5th Annual Technology Summit
May 28, 2025 PDF Version SANTA CLARA, Calif., May 28, 2025 (GLOBE NEWSWIRE) -- Silvaco Group, Inc. (Nasdaq: SVCO, “Silvaco”), a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and digital twin modeling through AI software and innovation, today announced that... -
Updated whitepaper for 2025 – “The new NIST standards are here: what does it mean for PQC?”
In August 2025, the US National Institute of Standards and Technology, published their finalized post-quantum cryptography (PQC) standards, FIPS 203, FIPS 204, and FIPS 205 – the culmination of an eight-year cycle of submission, research, and analysis. This long-awaited announcement marks a... -
EasylogicECO Provides Built-In Stage-Based Functional ECO Flows to Reduce Turnaround Time
HONG KONG — June 6, 2025 — Easy-Logic proudly introduces a groundbreaking stage-based ECO design environment, built into the EasylogicECO tool, to meet the rapidly evolving functional ECO (Engineering Change Order) demands of today’s ASIC design industry. These stage-based flows simplify...- AmandaK
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- Forum: Easy-Logic
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One Platform, Five Libraries: Certus Semiconductor’s I/O IP Portfolio for Every Application on TSMC 22nm ULL/ULP Technologies
May 28, 2025 Certus Semiconductor’s I/O libraries for TSMC’s 22nm ultra-low leakage (22ULL) and 22nm ultra-low power (22ULP) technologies offer robust, high-performance solutions tailored to a wide range of SoC designs — from ultra-low power IoT nodes to demanding consumer and automotive...- AmandaK
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- Forum: Certus Semiconductor
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Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions
April 23, 2025 Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions [Santa Clara, CA / April 23, 2025] – Certus Semiconductor, a leading provider of custom I/O and ESD Solutions to the semiconductor industry, is announcing an official partnership to join...- AmandaK
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- Forum: Certus Semiconductor
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Andes Technology Announces AndeSight™ IDE v5.4 to Streamline AI and Embedded Software Development on RISC-V
Press Highlights: l Native support for BF16/FP16 for AI workloads l Seamless NEON™ to RVV intrinsic support l Unified High-bandwidth Vector Memory (HVM) management library l Andes AutoOpTune™ AI-driven compiler optimization l Enhanced trace support and debugging features Hsinchu, Taiwan –...- AmandaK
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- Forum: Andes Technology
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Andes Technology Unveils AndesAIRE™ AnDLA™ I370: A Next-Generation Deep Learning Accelerator for Edge and Endpoint AI
Hsinchu, Taiwan –June 05, 2025 – Andes Technology, a leading supplier of high-performance, low-power 32/64-bit RISC-V processor cores and AI acceleration solutions, proudly announces the launch of AndesAIRE™ AnDLA™ I370, its latest Deep Learning Accelerator (DLA), engineered to bring advanced...- AmandaK
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- Forum: Andes Technology