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Through simulation-led product development, Turbotech becomes first company to successfully run a scalable turboprop out of a cryogenic hydrogen tank
Key Highlights
- Leveraging Ansys simulation to validate its innovative design, Turbotech’s hydrogen turbine propulsion system can operate with...
MotionEngine Hex software fuses UWB and motion sensor data to deliver 6-degree-of-freedom (6-DOF) motion tracking and intuitive control, enabling new interaction paradigms for electronic displays
ROCKVILLE, Md., June 24, 2025 /PRNewswire/ — Ceva, Inc. (NASDAQ: CEVA), the leading licensor of...
Santa Clara, CA — June 11 2025 – Mirabilis Design Inc. today announced an OEM agreement with Cadence Design Systems, Inc. to offer VisualSim Architect as part of Cadence’s system design portfolio. VisualSim provides enhanced system-level modeling, architectural exploration, and performance...
CAMPBELL, Calif. – June 23, 2025 – Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP for accelerating semiconductor creation, today announced the immediate availability of Magillem Packaging, a new software product designed to simplify and speed up the process of building advanced...
June 24, 2025
DAC 2025, San Francisco, USA
- New Innovator3D IC suite enables faster design completion with capacity, performance, compliance and data integrity
- Calibre 3DStress delivers early analysis/simulation of chip/package interactions at all stages of the design process
Siemens...
June 23, 2025
DAC 2025, San Francisco, USA
- Siemens adds AI capabilities across EDA portfolio, enhancing productivity, accelerating innovation and speeding time-to-market
- New AI system enables EDA engineers to leverage AI securely within established EDA environments
- Increased access to...
June 23, 2025
Tokyo, Japan
Rapidus has announced its collaboration with Siemens.
Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced a strategic collaboration with Siemens Digital Industries Software for semiconductor design and manufacturing processes for...
Woodcliff Lake, New Jersey — June 19, 2025
Configurable, streaming-optimized controller efficiently transfers large volumes of data to and from system memory and peripherals over 16 channels in each direction.
Semiconductor intellectual property core provider CAST has introduced a new direct...
Premier Chips‑to‑Systems Event Heads to the World’s Innovation Capital
SAN JOSE, CALIF. – June 19, 2025 – DAC, the Chips‑to‑Systems Conference, and the leading global event for chip design, is delighted to announce that its 64th and 65th editions will be held in San Jose at the San Jose...
16 Jun 2025
Expanded collaboration includes new multi-year IP agreement and joint development of advanced AI-driven flows on latest SF2P process node
SAN JOSE, Calif.— Cadence (Nasdaq: CDNS) today announced an expansion of its collaboration with Samsung Foundry, including a new multi-year IP...
SANTA CLARA, Calif.--(BUSINESS WIRE)--Intel today announced a series of leadership appointments aligned with its focus on strengthening customer relationships and becoming a more engineering-focused company.
Greg Ernst, a respected sales leader with more than 20 years of Intel experience, has...
The Keysight M8040A 64 GBaud High-Performance BERT and UXR0592A 59 GHz UXR-Series Oscilloscope offer a high-performance transmitter test and receiver test validation platform for PCIe 6.0 technology.
- Keysight's early access to PCIe CEM test tools enables AMD to reach 64 GT/s for...
Keysight’s Vector Component Analyzer, built on the latest N524XB series PNA-X Microwave Network Analyzers equipped with digital predistortion techniques, optimizes signal integrity and minimizes distortion to enable unprecedented data transmission speed.
- Achieved 280 Gbps in the 300 GHz...
Focus Is on Protecting Critical Markets Such as Automotive, Industrial IoT, and Secure Infrastructure
GRENOBLE, France – June 18, 2025 – CEA-Leti and Soitec today announced a strategic partnership to enhance the cybersecurity of integrated circuits (ICs) through the innovative use of fully...
CAMPBELL, Calif. – June 17, 2025 – In a market reshaped by the compute demands of AI, Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP for accelerating semiconductor creation, today announced an expansion of its multi-die solution, delivering a foundational technology for rapid...
June 16, 2025
Plano, Texas, USA
Siemens Digital Industries Software today opened its chalet at the Paris Air Show, Paris–Le Bourget Airport, France. Showcasing the transformative power of the Siemens Xcelerator platform, Siemens’ presence focuses on tackling critical Aerospace and Defense...
June 16, 2025
Plano, Texas, USA
Siemens and Samsung grow their cooperation with new solutions for power integrity, silicon photonics innovation, and analog mixed-signal reliability verification
Siemens Digital Industries Software announced today a significant expansion of its collaboration...
Companies Strengthen Collaboration with Successful Tape Out of HBM Customer Design, Certified EDA Flows, and PPA-Optimized IP on Samsung's Advanced Technologies
Highlights
- Successful customer tape out of HBM3 design on SF2 process and I-CubeS technology leveraged Synopsys 3DIC Compiler...
Based at CEA-Leti, Collaboration Focuses on Materials Engineering Solutions To Enable More Energy-Efficient AI Data Centers
SANTA CLARA, Calif. and GRENOBLE, France, June 16, 2025 – Applied Materials, Inc. and CEA-Leti today announced the next phase of their longstanding collaboration to...
Uncertainty Is The New Normal
… Stay Calm & Carry On!
Executive Summary
Annualised growth rates rebounded in April, with Total Semiconductors growing 22.8 percent, up from last month’s 18.7 percent number but still down from August 2024’s 28.5 percent cyclical peak.
Total ICs continued to...
