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The system is not a semiconductor. The RED circles are examples of semiconductors used in this system.
Quite a large difference, and there will be tariffs on many of these components. Already happening...
These fabs are struggling because automotive customers double & triple ordered, so the demand spike was false. Secondly, the "legacy" fabs in China are also ramping up on some of these nodes - they will undercut price to get share and don't have to worry about quarterly profits like the typical...
I think that this is a distinct advantage of several of these Asian countries, and their companies. They are not nearly as beholden to the "quarterly performance" that is the mainstay of corporate America. Intel has no such luxury. This has become an Achilles heal in trying to turn around such a...
TSMC may have been the foundry leader prior to FinFETs, but they were not a clear cut technology leader until Intel's massive stumble & stagnation at 10nm. Up to that time they were back and forth with Samsung for the #2 slot behind Intel's lead. I don't think that this is in much dispute, but I...
There are NO reliable sources for this type of data - yield % is highly proprietary and not shared by any makers, Intel or others.
Wait and see for what? The next "guess" at what is acceptable - this varies with each device and each maker.
It's such nonsense to hear all these declarations of...
Not in NY but at the old Sematech site in Austin - owned by UT Austin.
Group is called Texas Institute for Electronics (TIE): https://www.txie.org/
Focus is on Advanced Packaging and Heterogenous Integration technologies - definitely not targeted at front end device making.
It's part of DARPA's...
Wow! Let's dismiss decades of Intel dominance in the industry by saying that TSMC would have invented them too.
While possible, it doesn't change the fact of who did it, and when. They're hardly a yap dog - still have $50B revenue after 2 down years.
Intel is in short term crisis due to multiple...
There's quite a bit of naivete in some of these comments. Of course people take their knowledge and experience with them, that is their skill set.
But taking blueprints and (implied) process details and recipes is quite another thing. Even 20nm processes are quite valuable, and expensive, to...
Fixed it for a little bit more clarity on the Sherman fabs.
SM1 is projected to install tools by EOY'24, begin LVM ramp next year;
SM2 is likely 18-24 months lagging this schedule, market driven.
SM3 & SM4 build out also depends on the market, expected to be shells and/or loading tools by 2030...
This take is simply lazy, and lame to boot. Quoting books - whether the Bible or otherwise - is quite common for many executives. And us regular people. It's hardly a death knell, especially if you actually read & (attempt to) understand the quoted verses:
"Let your eyes look straight ahead...
Phase 1 or T1 is the first building, Phase 2 is part of the initial construction with infrastructure & possibly a shell building. The site is extendable up to 10 fabs, and Samsung submitted applications to the state of Texas for up to 11 facilities and the related tax exemptions. This is almost...
Both Samsung (near Austin) and TI (north of Dallas in Sherman) have started massive construction projects to add fab capacity in Texas. While TI is expanding its 300mm analog capacity, Samsung's fab is reported to include 5nm process technology.
Both of these fabs will need several thousand...
This is an interesting statement, but not terribly accurate really. I think that DoD has been quite open and clear about having domestic access to leading edge technology. TSMC is obviously part of this, and supplier to many current DoD suppliers - this is not a secret to anyone. Intel is also...
They're "retiring" 2 fabs also, maybe 10-15% of the new capacity (200mm/150mm wafers). They're also moving starts from foundries back to their own fabs, so maybe 25% is replacement. The rest is to support growth in new areas and expansion beyond just all analog all the time. Market will dictate...
These 2 fabs, plus RFAB-2, will provide TI with nearly 5X their current 300mm analog volume at RFAB - which is already the most capacity for an analog IDM. Close to 6X if the Utah facility (called LFAB) is included. That's quite a few more wafers & number of devices being made in the US...
