Depends on who you ask. If you ask a fab operator they say advanced packaging means 2.5D (COWOS, InFLO, EMIB, Foveros with passive base die, SiliconBox, etc) and 3D stacking (memory cubes (HBM), Foveros with active base die, SoIC, X-cube, etc.). I suppose you could also call CMOS image sensors...