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Several companies have announced stacked DRAM chips:
https://arxiv.org/abs/1809.08828
https://www.vikingtechnology.com/dram-modules/dram-memory-stacking/
https://www.slashgear.com/samsung-12-layer-3d-tsv-stacks-12-dram-chips-in-the-same-space-as-8-07594321/...
The average cost of a 180nm mask set is $100,000.00, however that same IC layout, but using 40nm masks will cost you $900,000.00. https://anysilicon.com/semiconductor-wafer-mask-costs/
The gate oxide is thinner for 40nm versus 180nm, which then effects the Vt of the transistor. So moving from...
Good point. The DRC rule deck grows by several X as you move down each smaller process node, so that's an interesting question to run a 180nm mask set on a 40nm process. I'm not sure that it would pass the DRC and ERC. Certainly the timing would change, because the smaller nodes have higher...
Each foundry process has a Process Design Kit (PDK) that is unique, and migrating from 180nm to a smaller process node requires engineering work like: functional simulation, logic synthesis using a new cell library, buying and integrating new 3rd party IP blocks, floor planning, standard cell...
Good eye, the handful of different die are there for testing purposes to make precise measurements about that wafer. On the test die they can more easily and efficiently measure IV curves, junction leakages, ESD breakdown voltages, P vs N channel conductance, resistivity of interconnect, etc.
Most foundries do not publish details about capacity per process node, because it’s confidential, although there are companies that will gladly sell you a report estimating these numbers.
Google is your friend:
https://epsnews.com/2021/02/10/5-fabs-own-54-of-global-semiconductor-capacity/
https://www.mordorintelligence.com/industry-reports/semiconductor-foundry-market
https://www.semi.org/en/news-media-press/semi-press-releases/global-200mm-fab-capacity-record-growth...
I was expecting a link to the Hejian web site, but found none in your article. There's a fab named Hejian that has an insecure website, but no mention of EDA software.
Quick Google search, 68020 was $487.00 at introduction in 1984, while the 68000 at the same time was priced down to just $15.00.
https://www.nytimes.com/1984/06/29/business/motorola-s-powerful-new-chip.html
Lam Research has a big footprint in Tualatin, they are located just a few blocks from my house, and Sherwood is turning much of its countryside into industrial and residential use. Growth is good for the semi business.
The mmWave support of 5G in the iPhone 13 could give you faster data rates, but the antenna needs to be within line of sight, even a tree branch or pane of glass will attenuate the signal, dropping your speeds.
https://www.tomsguide.com/news/iphone-13-could-get-a-major-5g-boost-heres-why
With the rapid expansion of semiconductor companies in China, the banks were too willing to extend credit in efforts to expand quicker. Let's see which Chinese venture picks up the pieces of Tsinghua Unigroup.
Paul, think about Pizza for a moment, why do they bake the entire pizza all at once, instead of 12 individual pieces? Answer: It’s faster, cheaper and offers greater quality control to fabricate an entire 200mm or 300mm wafer at one time, instead of 5,000 times.
SoftBank paid some $31B for Arm, when Arm only had $1.5B in revenue, wow, that was a high price. For an IPO of Arm, I think that most investors understand that their cell phone is using an Arm-licensed chip inside, so hopefully SoftBank would recoup their investment.
Arm being acquired by Softbank never made sense to me, because it lacked any synergy. Arm going IPO makes the most sense, as they maintain their independence, which their customers really want to happen.
