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Premier Chips‑to‑Systems Event Heads to the World’s Innovation Capital
SAN JOSE, CALIF. – June 19, 2025 – DAC, the Chips‑to‑Systems Conference, and the leading global event for chip design, is delighted to announce that its 64th and 65th editions will be held in San Jose at the San Jose...
16 Jun 2025
Expanded collaboration includes new multi-year IP agreement and joint development of advanced AI-driven flows on latest SF2P process node
SAN JOSE, Calif.— Cadence (Nasdaq: CDNS) today announced an expansion of its collaboration with Samsung Foundry, including a new multi-year IP...
SANTA CLARA, Calif.--(BUSINESS WIRE)--Intel today announced a series of leadership appointments aligned with its focus on strengthening customer relationships and becoming a more engineering-focused company.
Greg Ernst, a respected sales leader with more than 20 years of Intel experience, has...
The Keysight M8040A 64 GBaud High-Performance BERT and UXR0592A 59 GHz UXR-Series Oscilloscope offer a high-performance transmitter test and receiver test validation platform for PCIe 6.0 technology.
- Keysight's early access to PCIe CEM test tools enables AMD to reach 64 GT/s for...
Keysight’s Vector Component Analyzer, built on the latest N524XB series PNA-X Microwave Network Analyzers equipped with digital predistortion techniques, optimizes signal integrity and minimizes distortion to enable unprecedented data transmission speed.
- Achieved 280 Gbps in the 300 GHz...
Focus Is on Protecting Critical Markets Such as Automotive, Industrial IoT, and Secure Infrastructure
GRENOBLE, France – June 18, 2025 – CEA-Leti and Soitec today announced a strategic partnership to enhance the cybersecurity of integrated circuits (ICs) through the innovative use of fully...
CAMPBELL, Calif. – June 17, 2025 – In a market reshaped by the compute demands of AI, Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP for accelerating semiconductor creation, today announced an expansion of its multi-die solution, delivering a foundational technology for rapid...
June 16, 2025
Plano, Texas, USA
Siemens Digital Industries Software today opened its chalet at the Paris Air Show, Paris–Le Bourget Airport, France. Showcasing the transformative power of the Siemens Xcelerator platform, Siemens’ presence focuses on tackling critical Aerospace and Defense...
June 16, 2025
Plano, Texas, USA
Siemens and Samsung grow their cooperation with new solutions for power integrity, silicon photonics innovation, and analog mixed-signal reliability verification
Siemens Digital Industries Software announced today a significant expansion of its collaboration...
Companies Strengthen Collaboration with Successful Tape Out of HBM Customer Design, Certified EDA Flows, and PPA-Optimized IP on Samsung's Advanced Technologies
Highlights
- Successful customer tape out of HBM3 design on SF2 process and I-CubeS technology leveraged Synopsys 3DIC Compiler...
Based at CEA-Leti, Collaboration Focuses on Materials Engineering Solutions To Enable More Energy-Efficient AI Data Centers
SANTA CLARA, Calif. and GRENOBLE, France, June 16, 2025 – Applied Materials, Inc. and CEA-Leti today announced the next phase of their longstanding collaboration to...
Uncertainty Is The New Normal
… Stay Calm & Carry On!
Executive Summary
Annualised growth rates rebounded in April, with Total Semiconductors growing 22.8 percent, up from last month’s 18.7 percent number but still down from August 2024’s 28.5 percent cyclical peak.
Total ICs continued to...
11 Jun 2025
PARIS— At NVIDIA GTC Paris, Cadence (Nasdaq: CDNS) announced it is providing optimized solutions for the world’s first industrial AI cloud in collaboration with NVIDIA.
Customers will be able to accelerate the development of their industrial technology by leveraging Cadence’s...
TOKYO, Japan, Jun. 12, 2025 – The University of Tokyo (UTokyo) and TSMC (TWSE: 2330, NYSE: TSM) today announced the opening of the “TSMC-UTokyo Lab”, dedicated to advancing semiconductor research, education and talent incubation. As TSMC’s first joint lab with a university outside Taiwan, it...
SANTA CLARA, Calif.--(BUSINESS WIRE)--PCI-SIG® today announced the official release of the PCI Express® (PCIe®) 7.0 specification, reaching 128.0 GT/s, to members. PCIe 7.0 specification targets data-driven applications like AI/ML, 800G Ethernet, cloud, and Quantum computing. Pathfinding for the...
Haifa, Israel – June 10, 2025 – proteanTecs, a global leader in deep data monitoring for advanced electronics, is gaining significant traction as the partner of choice for AI chipmakers, delivering a dedicated suite of embedded solutions purpose-built for AI chips across cloud and edge...
June 24, 2025
12:00 PM -1:00 PM
Moscone West | San Francisco, CA
Calibre: Supercharge your chip integration efforts
Siemens is excited to host an exclusive event for our customers at the Design Automation Conference
Join us at DAC for lunch and learn how our new products can supercharge your...
June 10, 2025
Plano, Texas, USA
- Italian leader in custom handling and lifting machinery adopts Siemens’ NX and Teamcenter to drive development of huge machines in marinas and shipyards, infrastructure and heavy industry and foster cross-team collaboration
- Cimolai Technology worked with...
Oakland, CA (June 11, 2025) — NLET.org, the National Laboratory for Education Transformation, today announced the appointment of Richard Curtin, Managing Partner at Silicon Catalyst, as a Senior Advisor for the Semiconductor Industry and AI Sector workgroup.
Curtin brings decades of strategic...
Demonstration at 64 GT/s Reduces Design Risk and Accelerates Deployment of High-Performance AI and Computing Solutions with Proven PCIe 6.x Technologies
SUNNYVALE, Calif., June 11, 2025 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced that its collaboration with Broadcom has...
