Array ( [content] => [params] => Array (  => /forum/index.php?threads/video-and-presentation-material-of-intel-2020-architecture-day.12889/ ) [addOns] => Array ( [DL6/MLTP] => 13 [Hampel/JobRunner] => 1030170 [SV/ChangePostDate] => 2010200 [SemiWiki/Newsletter] => 1000010 [SemiWiki/WPMenu] => 1000010 [SemiWiki/XPressExtend] => 1000010 [ThemeHouse/XLink] => 1000670 [ThemeHouse/XPress] => 1010394 [XF] => 2011072 [XFI] => 1030270 ) [wordpress] => /var/www/html )
Intel looks strong for now. The one thing is architecture is more essential than node size or enhancements. To do both well was becoming too big for a single company before covid.
TSMC and Saamsung have to advertise their process roadmaps to attract the customers. Intel does not have customers for their process. Obviously there is a big difference between the future plans and what's available now. I am curious if TSMC has SuperFin or something similar in current process(es).From this event, I was surprised there is no new stuff in process technology. intel even did not show his process roadmap with code name and timeline which was typically observed in their past technology events. Maybe it is the reason why it was called Architecture Day. As all we know, Samsung and tsmc are talking about Nanosheet in their 3GAE/3GAP(MBCFET) and N2(Likely to be Nanosheet) for next 2-5 years, respectively. What we found in this intel event? Super"Fin". Super"MIM". Which are not so new in this industry. Someone even called it a "CIP" for process. Did we hear any comment about this new process "architecture" called GAA/Nanosheet? I did not hear it. If there were two horses for intel moving forward in the past, I would say one is saddled off now and unbalance could happen. Competition is critical for industry moving forward. The criterion of being #1 is you win over #2 and be acceptable by your customers. Good luck for tier 1 process technology leaders.