Array
(
    [content] => 
    [params] => Array
        (
            [0] => /forum/index.php?threads/us-based-wafer-backend-processing.17153/
        )

    [addOns] => Array
        (
            [DL6/MLTP] => 13
            [Hampel/TimeZoneDebug] => 1000070
            [SV/ChangePostDate] => 2010200
            [SemiWiki/Newsletter] => 1000010
            [SemiWiki/WPMenu] => 1000010
            [SemiWiki/XPressExtend] => 1000010
            [ThemeHouse/XLink] => 1000970
            [ThemeHouse/XPress] => 1010570
            [XF] => 2021270
            [XFI] => 1050270
        )

    [wordpress] => /var/www/html
)

US-based wafer backend processing

LaurynKPNTech

New member
We are looking to better understand the commercial market for US-based wafer backend processing. Specifically, dicing, thinning, and coring. What does the SemiWiki community think? Will there be a growing need for these types of services?
 

Paul2

Active member
Backend been stagnant for a long time, but advanced packaging, which I count separately from it, was really hot, and few people noticed that.

The total global demand for packaged chips isn't growing much because more, and more electronics is using microcontrollers, and SoCs which replaced tons of discrete components. And with each year, the BOM reduction is getting more, and more serious.

Take apart a 200X wireless computer mouse, and a 202X wireless mouse. There may be an up to 20-fold IC BOM difference.

On top of that, smartphones massacred MP3 players, cameras, remote controls, home AV, POS terminals, radios, and walkie talkies, and god knows how much more things.

And the highly anticipated IoT is not helping, to the big surprise of market forecasters. The "Smart Home" section in BestBuy been known to be a freezer.
 
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