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UMC Reports Sales for September 2024

Daniel Nenni

Admin
Staff member
October 07, 2024 02:00 AM Eastern Daylight Time
TAIPEI, Taiwan--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), today reported unaudited net sales for the month of September 2024.

Revenues for September 2024
UMC September 2024.jpg


(*) All figures in thousands of New Taiwan Dollars (NT$), except for percentages.
(**) All figures are consolidated
Additional information about UMC is available on the web at http://www.umc.com.

Contacts​

Michael Lin / David Wong
UMC, Investor Relations
Tel: + 886-2-2658-9168, ext. 16900
Email: david_wong@umc.com
jinhong_lin@umc.com
 
Being at the trailing edge doesn't pay it seems. I guess this shows the weakness of the market sans A.I spend
 
Told ya. Margins will continue collapsing as legacy fabs get built the world over. Mostly in China, but there are also the TSMC fabs in Japan and Europe, the Texas Instruments fabs in the US.

Unlike UMC this new capacity uses 300mm wafers even for trailing edge nodes. Which have better production economics.

UMC needs to find some way to stay competitive. Either they slash their costs down further or they move up the process node chain.

The deal that was announced with Intel for more modern FinFET processes might be a step in the right direction.
 
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Two things: I think TSMC is getting more aggressive at the mature nodes and the unit sales for the semiconductor industry are slowing. UMC is a good example of this, TSMC is not since they are raising prices and have no competition on the leading edge nodes (N3 and N2).

China is also a big factor for UMC business. China is building mature node capacity at an alarming rate. Japan is important to UMC as well and TSMC just built a mature node fab that competes with UMC in Japan.

The gloves are off in the foundry business!
 
Told ya. Margins will continue collapsing as legacy fabs get built the world over. Mostly in China, but there are also the TSMC fabs in Japan and Europe, the Texas Instruments fabs in the US.

Unlike UMC this new capacity uses 300mm wafers even for trailing edge nodes. Which have better production economics.

UMC needs to find some way to stay competitive. Either they slash their costs down further or they move up the process node chain.

The deal that was announced with Intel for more modern FinFET processes might be a step in the right direction.

It greatly depends on what kind of legacy fabs. 130nm+ is simply greatly lacking equipment after it went out of production, and all second hand tools were sold to China around 2017.
 
It greatly depends on what kind of legacy fabs. 130nm+ is simply greatly lacking equipment after it went out of production, and all second hand tools were sold to China around 2017.
KrF and i-line lithography machines for 300mm wafers are still in production.

Nexchip built a brand new fab in China with 300mm wafers which makes 150nm-55nm process chips for DDICs.
They have a 150nm logic process if you want it.

1728417921163.png


What you can no longer get is 200mm equipment which is not in production anymore. Well, maybe you can get it from the Russians in some years, since all the equipment they are going to be producing seems to be for 150mm and 200mm wafers. ;)

The industry should just switch to 300mm.
 
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The industry should just switch to 300mm.
It does, at the speed of a lame snail. Most of 200mm production volume is legacy product which is not going to be redesigned for <130nm, or proprietary process. Most of 200mm order volume are very small volume tapeouts, where 200mm price at MOQ will be unbeatable for years to come.

If you do custom process, discreetes development, there the manually operated equipment is actually a benefit.
 
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