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TSMC is poised to boost its ties with memory chip vendors including Micron Technology and SK Hynix to strengthen the logic foundry's 3D silicon stacking and other advanced packaging technologies, according to industry sources.
www.digitimes.com
I'm not sure I see this as any kind of event for NAND memory producers but I'm curious what the take is from the admission that advanced packaging is the future; particularly in light an early adopter of Intel Foveros with Amazon.
TSMC is poised to boost its ties with memory chip vendors including Micron Technology and SK Hynix to strengthen the logic foundry's 3D silicon stacking and other advanced packaging technologies, according to industry sources.
www.digitimes.com
I'm not sure I see this as any kind of event for NAND memory producers but I'm curious what the take is from the admission that advanced packaging is the future; particularly in light an early adopter of Intel Foveros with Amazon.
Intel has exited out memory business already, at least in the manufacturing part of business. I don't know if there is anything Intel can offer.
Micron is a different story. They have major fabs in Taiwan close to TSMC. There isn't any similar product or market competition between TSMC and Micron. As far as I know, they have a very good relationship for a long time.
Good question. Intel is probably making Optane products for enterprise in New Mexico by using excessive inventory made by the old Micron Utah fab. According to this following article, Intel may not make any new memory components at present time.
Intel has exited out memory business already, at least in the manufacturing part of business. I don't know if there is anything Intel can offer.
Micron is a different story. They have major fabs in Taiwan close to TSMC. There isn't any similar product or market competition between TSMC and Micron. As far as I know, they have a very good relationship for a long time.
Micron Taiwan ex-Chairman, Mr. Hsu, just joined tsmc as RD VP in advanced package development. It might imply some future collaboration. View attachment 779
According to Tip3X (a small website I've never heard previously of), TSMC Chairman Mark Liu hinted that TSMC would start cooperating with Micron in the field of logic and memory chips.
According to the latest report, the chairman of MediaTek recently asked the chairman of Macronix how to enhance the industrial value of the storage industry. TSMC Chairman Liu Deyin made a rare addition. He said that at present, Micron memory has led the world, and Micron’s production is in...
www.tip3x.com
Perhaps that's why Micron decided to install EUV machines at their Taichung fab later this year.
Taipei, May 25 (CNA) American dynamic random access memory (DRAM) maker Micron Technology is set to install the industry's most cutting-edge technology -- extreme ultraviolet (EUV) lithography equipment -- in its facility in Taichung this year, the company said Wednesday.
I believe it, pretty sure DRAM had stuff like vertical transistors and air gaps before logic. I don't think AI can truly scale until someone figures out a good in-memory implementation, and Micron seems to be the most aggressive in this area among memory manufacturers.
Back when Intel wasn't a dumpster fire they effectively leveraged R&D from their memory business for their processor technologies, particularly the backend stuff. Memory tends to bring out the worst problems in scaling due to the vast statistical nature of memory array bitcells, WL/BL drivers, and small signal BL sense amplifiers.
According to Tip3X (a small website I've never heard previously of), TSMC Chairman Mark Liu hinted that TSMC would start cooperating with Micron in the field of logic and memory chips.
According to the latest report, the chairman of MediaTek recently asked the chairman of Macronix how to enhance the industrial value of the storage industry. TSMC Chairman Liu Deyin made a rare addition. He said that at present, Micron memory has led the world, and Micron’s production is in...
www.tip3x.com
Perhaps that's why Micron decided to install EUV machines at their Taichung fab later this year.
Taipei, May 25 (CNA) American dynamic random access memory (DRAM) maker Micron Technology is set to install the industry's most cutting-edge technology -- extreme ultraviolet (EUV) lithography equipment -- in its facility in Taichung this year, the company said Wednesday.
