"TSMC carefully evaluates technology innovations such as new transistor structures and new tools and considers their maturity, cost, and benefit to customers before deploying them to volume production," the chipmaker told The Reg.
"As we disclosed at our 2024 Technology Symposiums earlier this year, our EUV tool count was ten times greater in 2023 versus 2019 (I estimate 13), accounting for 56 percent of the global installed base (I estimate 234), and our EUV wafer moves were 30 times greater. TSMC plans to bring in high-NA EUV scanners first for R&D to develop the associated infrastructure and patterning solution needed for customers to fuel innovation," it added.
www.theregister.com
"As we disclosed at our 2024 Technology Symposiums earlier this year, our EUV tool count was ten times greater in 2023 versus 2019 (I estimate 13), accounting for 56 percent of the global installed base (I estimate 234), and our EUV wafer moves were 30 times greater. TSMC plans to bring in high-NA EUV scanners first for R&D to develop the associated infrastructure and patterning solution needed for customers to fuel innovation," it added.
TSMC prioritizing bringing in NA EUV equipment
May not see full use until 2030 – even if it arrives this year
www.theregister.com