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(Bloomberg) -- Taiwan Semiconductor Manufacturing Co. and GlobalFoundries Inc. have finished negotiating binding agreements for billions of dollars in grants and loans to support US factories, people familiar with the matter said.
The deals, announced as tentative agreements earlier this year, come as the Biden administration races to get Chips and Science Act money out the door before the end of its term in January.
It is unclear when the agreements will officially be signed and the incentives unveiled, according to the people, who asked not to be identified because the conversations are private. The award amounts are roughly in line with the preliminary agreements, the people said.
The deals, announced as tentative agreements earlier this year, come as the Biden administration races to get Chips and Science Act money out the door before the end of its term in January.
It is unclear when the agreements will officially be signed and the incentives unveiled, according to the people, who asked not to be identified because the conversations are private. The award amounts are roughly in line with the preliminary agreements, the people said.