TSMC is dedicated to advancing leading-edge technologies and unleashing innovation. The Company unveiled its latest advanced logic, TSMC 3DFabric® silicon stacking and advanced packaging, and specialty technologies at its 30th Technology Symposium, powering the next generation of artificial intelligence (AI) innovations with silicon leadership. TSMC debuted the TSMC A16™ technology, which features leading-edge nanosheet transistors with an innovative backside power rail solution to provide improved logic density and performance. TSMC also introduced its System-on-Wafer (TSMC-SoW™) technology that enables a large array of dies on a 300mm wafer, providing more compute power to address hyperscale data centers’ future AI requirements. Hosting both in-person and virtual events this year, TSMC topped last year’s attendance with more than 8,400 visitors in North America, Europe, Taiwan, China, and Japan, continuing to fuel the momentum of innovation.
We are entering an AI-empowered world, where artificial intelligence not only runs in data centers, but PCs, mobile devices, automobiles, and even the Internet of Things. At TSMC, we are offering our customers the most comprehensive set of technologies to realize their visions for AI, from the world’s most advanced silicon, to the broadest portfolio of advanced packaging and 3D IC platforms, to specialty technologies that integrate the digital world with the real world.
Dr. C.C. Wei,Chairman and CEO of TSMC
Major Technology Highlights at the 2024 Technology Symposium Include:
At this year’s event, Astera Labs won the attendee-selected Demo of the Year Award in North America with its AI-dedicated high-speed connectivity solutions. Astera Labs’ PCIe/CXL technology-based smart retimers, similar to the nervous system of data centers, are widely deployed in cloud and AI infrastructure. This supports the ever-expanding clusters of AI processors and generative AI training workloads, enhancing the efficiency and diversity of cloud AI and machine learning architecture applications. In Europe, Raspberry Pi won the award with its performance-efficiency balancing 5th generation single board computer, which is widely used in educational platforms, industrial computers, and consumer electronics. As of 2023, Raspberry Pi reports cumulative sales of 60 million units, deepening educational equity and energy efficiency.
The 2024 Technology Symposium Invites Industry Luminary and Customers Around the Globe to Share Insights
Semiconductors are the cornerstone of technological innovation and societal progress. As AI applications continue to evolve, TSMC will continue to invest in semiconductor technology development, enhance advanced system integration services, and expand its global manufacturing footprint. By collaborating with customers, TSMC aims to accelerate product innovation and create a sustainable, mutually beneficial future.
We are entering an AI-empowered world, where artificial intelligence not only runs in data centers, but PCs, mobile devices, automobiles, and even the Internet of Things. At TSMC, we are offering our customers the most comprehensive set of technologies to realize their visions for AI, from the world’s most advanced silicon, to the broadest portfolio of advanced packaging and 3D IC platforms, to specialty technologies that integrate the digital world with the real world.
Dr. C.C. Wei,Chairman and CEO of TSMC
Major Technology Highlights at the 2024 Technology Symposium Include:
The 2024 Technology Symposium Debuts “Customer Pitch” to Expand Emerging Customers’ Resources
TSMC enhances customer product competitiveness by providing high-quality technology and services. This year’s Technology Symposium introduced a “Customer Pitch” session at the North America event, inviting eight startup customers to present their unique product ideas, market positioning, and long-term vision. A total of 27 venture capitalists attended the session designed to assist these startups expand their resources. TSMC also invited industry luminary, Dr. Andrew Ng, to shed light on AI’s applications across the economy and society, and customers from around the globe to share TSMC collaboration success stories covering AI, HPC, and automotive applications. The TSMC “Innovation Zone” featured 41 emerging customers who showcased a broad range of innovative technologies and products focused on future AI applications. These covered generative AI applications, cloud and edge AI chipsets, server-based networking and power modules, automotive high-speed connectivity and sensing solutions, single board computer solutions and applications, energy-harvesting controllers, and vital sensors.At this year’s event, Astera Labs won the attendee-selected Demo of the Year Award in North America with its AI-dedicated high-speed connectivity solutions. Astera Labs’ PCIe/CXL technology-based smart retimers, similar to the nervous system of data centers, are widely deployed in cloud and AI infrastructure. This supports the ever-expanding clusters of AI processors and generative AI training workloads, enhancing the efficiency and diversity of cloud AI and machine learning architecture applications. In Europe, Raspberry Pi won the award with its performance-efficiency balancing 5th generation single board computer, which is widely used in educational platforms, industrial computers, and consumer electronics. As of 2023, Raspberry Pi reports cumulative sales of 60 million units, deepening educational equity and energy efficiency.
The 2024 Technology Symposium Invites Industry Luminary and Customers Around the Globe to Share Insights
Semiconductors are the cornerstone of technological innovation and societal progress. As AI applications continue to evolve, TSMC will continue to invest in semiconductor technology development, enhance advanced system integration services, and expand its global manufacturing footprint. By collaborating with customers, TSMC aims to accelerate product innovation and create a sustainable, mutually beneficial future.