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Texas Instruments selects Sherman for potential $30 billion semiconductor chipmaking campus

Daniel Nenni

Admin
Staff member
Good news of course. More capacity equals better pricing, absolutely.


Texas Instruments, based in Dallas, is betting heavily on US-made chips and has an ambitious plan to invest up to $ 30 billion to build up to four new semiconductor factories in Sherman.

TI said Wednesday that it will begin building the first two plants next year to produce its 300-millimeter wafers, which are used in automobiles and trucks to industrial machinery. It estimates that chip production will start by 2025.

Two more plants could be added at the 4.7 million square foot Grayson County facility to meet future chip demand. The company said the plants could employ up to 3,000 workers when completed.

“Sherman offers some unique advantages such as a competitive business environment, access to a highly skilled technical staff and an existing supplier base,” said Kyle Flessner, senior vice president of technology and manufacturing at TI. “Being close to our other manufacturing facilities in Dallas and Richardson will help us further increase our efforts and operational efficiencies as we expand our 300 millimeter manufacturing presence in North Texas.”

 

chipsntexas

New member
These 2 fabs, plus RFAB-2, will provide TI with nearly 5X their current 300mm analog volume at RFAB - which is already the most capacity for an analog IDM. Close to 6X if the Utah facility (called LFAB) is included. That's quite a few more wafers & number of devices being made in the US, primarily in Texas. The DFW sprawl is now closing in on the Red River...
 

hist78

Well-known member
These 2 fabs, plus RFAB-2, will provide TI with nearly 5X their current 300mm analog volume at RFAB - which is already the most capacity for an analog IDM. Close to 6X if the Utah facility (called LFAB) is included. That's quite a few more wafers & number of devices being made in the US, primarily in Texas. The DFW sprawl is now closing in on the Red River...
Either 5 or 6 times of TI's current 300mm analog capacity, that's a huge increase for any manufacturers. Can TI and the market take so much additional capacity in a short period of time?
 

chipsntexas

New member
Either 5 or 6 times of TI's current 300mm analog capacity, that's a huge increase for any manufacturers. Can TI and the market take so much additional capacity in a short period of time?
They're "retiring" 2 fabs also, maybe 10-15% of the new capacity (200mm/150mm wafers). They're also moving starts from foundries back to their own fabs, so maybe 25% is replacement. The rest is to support growth in new areas and expansion beyond just all analog all the time. Market will dictate loading, I am sure, but the space & capacity will be in place to respond (more) quickly if needed.
 
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