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System Level Interconnect Prediction (SLIP)

Daniel Payne

The deadlines for SLIP 2014 are extended by 2 weeks as follows:

Abstract Registration: March 24, 2014
Paper Submission: March 29, 2014

16th IEEE/ACM International Workshop on System-Level Interconnect Prediction (SLIP 2014)
Date: June 1, 2014
Location: Moscone Convention Center, San Francisco, CA, USA
Co-located with the 51th IEEE/ACM Design Automation Conference
Co-sponsored by ACM SIGDA and the IEEE Computer Society

The general technical scope of the workshop is the design, analysis, prediction, and optimization of interconnect and communication fabrics in electronic systems. The organizing committee invites original contributions to the workshop. These contributions include papers, tutorials, panels, special sessions, and posters. We accept papers based on novelty and contributions to the advancement of the field. The accepted papers will be published in the ACM and IEEE digital libraries. The special focus topic is 3D interconnects; papers that target this topic are highly encouraged. Selected papers will be invited as a special section or issue in a leading ACM or IEEE journal or magazine.

Technical topics include but are not limited to:
1. Interconnect prediction and optimization at various IC design stages
2. Interconnect design challenges and system-level design for FPGAs and NOCs
3. Design, analysis, and optimization of power and clock networks
4. Interconnect reliability
5. Interconnect topologies and fabrics of multi- and many-core architectures
6. Design-for-manufacturing (DFM) and yield techniques for interconnects
7. High speed chip-to-chip interconnect design
8. Design and analysis of chip-package interfaces
9. Power consumption of interconnects
10. 3D interconnect design and prediction
11. Emerging interconnect technologies
12. Applications of interconnects to social, genetic, and biological systems
13. Co-optimization of interconnect technology and chip design

We invite authors to submit papers of 4 to 8 pages, double-columned, 9pt or 10pt font in ACM proceedings format available at

To permit double blind review, all papers must remove author information (submissions with author information will be rejected). Authors should submit papers electronically in PDF at:

The workshop includes keynotes, regular paper sessions, interactive panels, tutorials, invited talks, and interactive poster sessions. Our program also includes lunch, refreshments, and a traditional social dinner with fun elements.

Abstract Registration: March 10, 2014 - extended to March 24, 2014
Paper Submission: March 15, 2014 - extended to March 29, 2014
Author Notification: April 15, 2014
Final Version Upload: May 1, 2014

General Chair: Rasit O. Topaloglu, IBM, USA
Technical Program Chair: Sung Kyu Lim, Georgia Inst. of Technology, USA
Finance Chair: Baris Taskin, Drexel University, USA
Publication Chair: Umit Ogras, Arizona State University, USA
Publicity Chair: Tsung-Yi Ho, National Cheng Kung Univ., Taiwan

Steering Committee Members:
Chuck Alpert, Cadence, USA
Deming Chen, UIUC, USA
Chung-Kuan Cheng, UCSD, USA
Andrew B. Kahng, UCSD, USA
Michael Kishinevsky, Intel, USA