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"TAIPEI – South Korea’s Samsung Electronics Co., the world’s largest memory chipmaker, is partnering with its foundry rival Taiwan Semiconductor Manufacturing Co. (TSMC) to jointly develop a next-generation artificial intelligence chip, HBM4, in a push to strengthen their positions in the fast-growing AI chip market.
Dan Kochpatcharin, head of Ecosystem and Alliance Management at TSMC, said during a Semicon Taiwan 2024 forum on Thursday that the two companies are co-developing a bufferless HBM4 chip."
Dan Kochpatcharin, head of Ecosystem and Alliance Management at TSMC, said during a Semicon Taiwan 2024 forum on Thursday that the two companies are co-developing a bufferless HBM4 chip."
Samsung Electronics, TSMC tie up for HBM4 AI chip development - KED Global
TAIPEI – South Korea’s Samsung Electronics Co., the world’s largest memory chipmaker, is partnering with its foundry rival Taiwan Semiconduct
www.kedglobal.com
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