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Phononic Perfects Solid State Heat Transfer, Mega Market

Arthur Hanson

Active member
Phonic has now brought to market solid state heat transfer using the Peltier effect which is explained in the article below. This will be a critical to cooling semis and mems in a localized manner rather than wasting energy cooling a much larger space. This will allow devices to shrink much more than if the whole device needed to be cooled. This should allow for entirely new applications for semis where space and energy are critical issues. Just like the semi world this technology will probably advance through many generations and over time revolutionize temperature control and will probably be built on larger scales using similar tools as used to build display screens and solar panels on everything from very, very small scale to entire buildings as the application advances through generations, just like all other technologies. Heat transfer is a world wide mega market that is ripe for technological change. Like all technology items, expect the cost to go down dramatically and the performance to go up just as fast. As with the manufacture of solar panels and display screens with AMAT mastering large scale fabrication, this might be a whole new frontier for them in large panels that could be used on buildings and revolutionize the industry with solid state cooling doing away with the complex mechanicals, control systems and additional distribution vents in large buildings that add to the bulk and cost. This could revolutionize heating and cooling by acting as a solid state heat pump.

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New member
A great article. Innovation is more than improving an existing solution. Many times it's about taking a new look at an old problem, sometimes with discarded ideas that are now relevant given our new capabilities.

crossPORT is doing exactly this... transforming data exchanges at the edge with a new perspective that has always been there. Can't wait to transform the semiconductor industry with reduced latencies and simpler, lower power data exchange.

Looking forward to collaborating with anyone looking to decrease latency between processor units and reducing the cost of memory.

(I suspect this may be every member, but being as I am a non-engineer, i can only hope a few will see past the lack of iron ring and consider that engineering may have overlooked something. and that old ideas can be new again)

Search crossPORT Networks for our IEEE papers.

Arthur Hanson

Active member
I suggest you look at the Intel 3dXpoint memory modules under the Optane name. Look for Micron to come out with their versions of this soon. TSM will shortly be putting Crossbar phase change memory in on chip memory. Look forward to many changes in this area in the next year.