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? on Packaging, Layers Replacing Node Shrink

Arthur Hanson

Active member
With nodes of 5nm and below getting increasingly expensive and difficult to produce, will additional sophisticated layering and packaging technologies become the next area of significant advancement in the semi sector? Also will this be how shrink using layers and packaging will be applied to MEMS and increase the opportunities for their usefulness? Memory has been using ever increasing layers and could sophisticated packaging extend the shrink being applied? Any thoughts on other paths the semi/nanotech sector will be using for increased performance at lower cost would be appreciated.