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New SEMI standard addressing needs at 7nm and beyond

mhagmann

Member
Last week, at SEMICON-West, a new SEMI standard working group was formed to address the needs for improved metrology at and below the 7-nm technology node. We recognize that there are many needs at these nodes but hypothesize that the one which is most easily addressed is improved metrology to improve fault analysis. SEMI now has over 1,000 standards to improve the products of the semiconductor industry. One metrologist wrote that deficiencies in the present methods of Scanning Spreading Resistance Microscopy (SSRM) and Scanning Capacitance Microscopy (SCM) for metrology were first noted at the 45-nm node. We were surprised to see there are no SEMI standards for either SSRM or SCM so our first effort is to define the best practice for these two methods. Our group has 19 members representing the foundries, the companies producing instruments for metrology, and several scientists from NIST. We would welcome new members, so please contact me by messaging through Semiwiki.
Mark
 

mhagmann

Member
Objectives of our new SEMI standard working group:
1. Determine best practice with the present tools: Our members at GlobalFoundries, Micron Technology, IMEC, NIST, Rudolph Technologies, and others, will establish a practice standard within six months because now there are no standards for SSRM or SCM which are the most frequently used methods to support production by failure analysis in the semiconductor industry at the finer lithography nodes.
2. Advance from a practice standard to a method standard including the first multi-institution round-robin comparison of SSRM with SCM and other present methods.
We would welcome other members of SEMI who would like to work with this group because of its significance in the present "crisis" at and beyond the 7-nm technology node. Please contact me by in-mail.
Mark
 
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