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Interview with ex-TSMC/Intel researcher/manager/consultant

X

XYang2023

Active member
I had the transcription in Chinese but it is too long and I did not translate it into English.

Here are the main points:

Key Problems:​

  1. Competitive Decline: Intel has fallen behind competitors like Nvidia, TSMC, and AMD, struggling to maintain its market dominance.
  2. Cultural and Operational Inefficiencies: The company’s internal culture has shifted, losing the agility and execution-focused ethos that once drove success. Pat did not seem to address the issue.
  3. Foundry Transition Difficulties: Intel’s attempt to pivot into the foundry business is hindered by cultural resistance and customer service deficiencies.
  4. Workforce Bloat: A large, costly, and misaligned workforce, especially in the Foundry division, adds inefficiency and expenses.

Recommended Actions:​

  1. Streamline Operations and Revitalize Culture: Reinstate a results-driven approach (accountability) to boost core business areas.
  2. Restructure: Separate manufacturing and design divisions to focus on specialization. He did not suggest a full separation as that does not make sense. He suggests at the moment, there should be enough separation to facilitate moving the strategy forward.
  3. Optimize Workforce: Reduce the bloated workforce (aggressively) and align roles to strategic objectives.
  4. Invest in Customer Relations and Agility: Develop a customer-focused culture to attract major clients and improve adaptability.
One example of bloatedness is IFS:

In addition to the challenges Intel faces with competition, internal culture, and operational inefficiencies, the interview highlights workforce bloat as a significant issue. Intel has reportedly accumulated a large, costly workforce—around 1,400 staff in its Foundry Service alone—without clearly aligning their roles with business goals. This bloated structure has led to inefficiency and unnecessary expenses, suggesting a need for workforce optimization.

He thinks as it is a mediation between clients and factory, hundreds (He said might be 100) of specialised and dedicated employees might be enough.

楊光磊 - 科技、民主與社會研究中心

楊光磊博士自國立台灣大學電機學系畢業，並取得加州大學柏克萊分校電機電腦博士學位。旅美期間曾任麻省理工學院林肯國
dset.tw dset.tw
 
Yang Guanglei
Dr. Yang Guanglei graduated from the Department of Electrical Engineering at National Taiwan University and received a PhD in Electrical and Computer Engineering from the University of California, Berkeley. During his stay in the United States, he served as a researcher at MIT's Lincoln National Laboratory and a senior technician at Hewlett-Packard Company. After leaving the United States, he worked at Chartered Semiconductor, Winbond Electronics, and World Semiconductor, and then served as a research and development manager at TSMC from 1998 to 2005. Director, responsible for the research and development of 0.18 micron, 0.13 micron and 65 nanometer advanced processes. In 2005, he went to the United States to take charge of TSMC's US R&D plan and advanced technology customer cooperation projects. In 2012, he was transferred to the director of TSMC's R&D Basic Engineering Division and Advanced Technology Management Office.

In 2001, TSMC began mass production of the 0.13 micron process, which laid the technical foundation for TSMC to significantly lead its competitors. Several participating R&D warriors were later known as the "Six Knights of TSMC R&D", and Dr. Yang Guanglei was one of them. At that time, he was Key player responsible for integrating the overall logic process.

After Dr. Yang Guanglei retired from TSMC, he served as an independent director of SMIC and a technical consultant of Intel. He is currently an adjunct professor of the Leadership Program at National Taiwan University and is passionate about talent development issues.

Other positions: Adjunct Professor, Leadership Program, National Taiwan University
Highest educational level: PhD, Institute of Electrical and Computer Engineering, University of California, Berkeley
DSET research areas:semiconductor
Research expertise:Enterprise digitalization, Semiconductor process, workplace education
Personal email: kkyoung168@ntu.edu.tw
 
XYang2023 said:
I had the transcription in Chinese but it is too long and I did not translate it into English.

Here are the main points:

Key Problems:​

  1. Competitive Decline: Intel has fallen behind competitors like Nvidia, TSMC, and AMD, struggling to maintain its market dominance.
  2. Cultural and Operational Inefficiencies: The company’s internal culture has shifted, losing the agility and execution-focused ethos that once drove success. Pat did not seem to address the issue.
  3. Foundry Transition Difficulties: Intel’s attempt to pivot into the foundry business is hindered by cultural resistance and customer service deficiencies.
  4. Workforce Bloat: A large, costly, and misaligned workforce, especially in the Foundry division, adds inefficiency and expenses.
Click to expand...
I totally agree with all 4 Workforce Bloat and culture are the biggest hinderence it will solve 1 and 3 mostly
 
The dude never worked inside Intel and what he suggest is t novel or based on some true inside info.

Funny the dude worked for SMiC after TSMC says something too!
 
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