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Intel Foundry gets Two new customer

siliconbruh999

Well-known member
What’s New: Intel Foundry has announced the onboarding of new defense industrial base (DIB) customers, Trusted Semiconductor Solutions and Reliable MicroSystems, as part of the third phase of the Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) efforts under the Trusted & Assured Microelectronics (T&AM) Program in the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)). The RAMP-C project, awarded through the Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Authority (OTA), allows DIB customers to take advantage of Intel Foundry’s leading-edge Intel 18A process technology and advanced packaging for prototypes and high-volume manufacturing of commercial and DIB products for the U.S. Department of Defense (DoD).

“We are very excited to welcome Trusted Semiconductor Solutions and Reliable MicroSystems to the RAMP-C project we are engaged in with the DoD. The collaboration will drive cutting-edge, secure semiconductor solutions essential for our nation’s security, economic growth and technological leadership. We are proud of the pivotal role Intel Foundry plays in supporting U.S. national defense and look forward to working closely with our newest DIB customers to enable their innovations with our leading-edge Intel 18A technology.”
–Kapil Wadhera, vice president of Intel Foundry and general manager of Aerospace, Defense and Government Business Group
Why It’s Important: As the only U.S. company that designs and manufactures leading-edge semiconductor technology, Intel plays a critical role in strengthening the country’s long-term economic competitiveness and national security. By working together on RAMP-C, Intel Foundry and DoD’s T&AM program accelerate the growth of advanced semiconductor manufacturing in the U.S. Moreover, Intel Foundry’s expansion of 18A fabrication is rebalancing the global supply chain with a trusted, resilient and sustainable source of the most advanced technologies for microelectronics devices.

“RAMP-C continues to promote development of leading-edge microelectronics for both DoD and commercial applications and supports advanced semiconductor design and manufacturing in the U.S. to strengthen national security,” said Dr. Catherine Cotell, OUSD(R&E)’s T&AM program manager.

Under the RAMP-C project, Intel Foundry enables strategic customers as well as intellectual property (IP), electronic design automation (EDA) and design services providers that help accelerate design time on Intel Foundry’s state-of-the-art technologies.

Intel Foundry and its ecosystem provide a turnkey approach to designing, testing and manufacturing leading-edge chips by offering DIB customers access to the latest process technologies and advanced packaging capabilities.

Enabling DIB customers’ early access to leading-edge semiconductor technology is key to meeting the defense industry’s critical size, weight and power requirements. Intel 18A, the company’s most important transistor innovation since it introduced FinFET (fin field-effect transistor) to high-volume manufacturing in 2011, integrates the company’s new PowerVia backside power and RibbonFET gate-all-around (GAA) technologies to significantly improve performance per-watt and density.

DIB customers can also use Intel Foundry’s advanced packaging technologies — including embedded multi-die interconnect bridge (EMIB), which enables high interconnect density for heterogeneous chips — to meet today’s complex computing requirements.

What It Means: RAMP-C has seen remarkable success since its launch in October 2021, and Intel Foundry has played a pivotal role across its three phases.

  • Foundation Building: Led the efforts to develop technology, creating intellectual property and an ecosystem, and preparing customers for test chip tape-outs.
  • Expansion and Onboarding: Expanded the customer base by onboarding the first major DIB customers, including Boeing and Northrop Grumman. Intel Foundry continues to ramp IP and ecosystem solutions, enabling new customers to design, develop and tape-out solutions based on Intel 18A process technology.
  • Advanced Prototyping and Manufacturing: With the program award in April 2024, Intel Foundry advanced the tape-out and testing of early DIB product prototypes. This phase highlights the readiness of Intel 18A technology for high-volume manufacturing. It also marked the beginning of extensive test chips and multiple commercial and DIB product prototype tape-outs, including for the most recent DIB customers, Trusted Semiconductor Solutions and Reliable MicroSystems.

 
What’s New: Intel Foundry has announced the onboarding of new defense industrial base (DIB) customers, Trusted Semiconductor Solutions and Reliable MicroSystems, as part of the third phase of the Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) efforts under the Trusted & Assured Microelectronics (T&AM) Program in the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)). The RAMP-C project, awarded through the Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Authority (OTA), allows DIB customers to take advantage of Intel Foundry’s leading-edge Intel 18A process technology and advanced packaging for prototypes and high-volume manufacturing of commercial and DIB products for the U.S. Department of Defense (DoD).


Why It’s Important: As the only U.S. company that designs and manufactures leading-edge semiconductor technology, Intel plays a critical role in strengthening the country’s long-term economic competitiveness and national security. By working together on RAMP-C, Intel Foundry and DoD’s T&AM program accelerate the growth of advanced semiconductor manufacturing in the U.S. Moreover, Intel Foundry’s expansion of 18A fabrication is rebalancing the global supply chain with a trusted, resilient and sustainable source of the most advanced technologies for microelectronics devices.

“RAMP-C continues to promote development of leading-edge microelectronics for both DoD and commercial applications and supports advanced semiconductor design and manufacturing in the U.S. to strengthen national security,” said Dr. Catherine Cotell, OUSD(R&E)’s T&AM program manager.

Under the RAMP-C project, Intel Foundry enables strategic customers as well as intellectual property (IP), electronic design automation (EDA) and design services providers that help accelerate design time on Intel Foundry’s state-of-the-art technologies.

Intel Foundry and its ecosystem provide a turnkey approach to designing, testing and manufacturing leading-edge chips by offering DIB customers access to the latest process technologies and advanced packaging capabilities.

Enabling DIB customers’ early access to leading-edge semiconductor technology is key to meeting the defense industry’s critical size, weight and power requirements. Intel 18A, the company’s most important transistor innovation since it introduced FinFET (fin field-effect transistor) to high-volume manufacturing in 2011, integrates the company’s new PowerVia backside power and RibbonFET gate-all-around (GAA) technologies to significantly improve performance per-watt and density.

DIB customers can also use Intel Foundry’s advanced packaging technologies — including embedded multi-die interconnect bridge (EMIB), which enables high interconnect density for heterogeneous chips — to meet today’s complex computing requirements.

What It Means: RAMP-C has seen remarkable success since its launch in October 2021, and Intel Foundry has played a pivotal role across its three phases.

  • Foundation Building: Led the efforts to develop technology, creating intellectual property and an ecosystem, and preparing customers for test chip tape-outs.
  • Expansion and Onboarding: Expanded the customer base by onboarding the first major DIB customers, including Boeing and Northrop Grumman. Intel Foundry continues to ramp IP and ecosystem solutions, enabling new customers to design, develop and tape-out solutions based on Intel 18A process technology.
  • Advanced Prototyping and Manufacturing: With the program award in April 2024, Intel Foundry advanced the tape-out and testing of early DIB product prototypes. This phase highlights the readiness of Intel 18A technology for high-volume manufacturing. It also marked the beginning of extensive test chips and multiple commercial and DIB product prototype tape-outs, including for the most recent DIB customers, Trusted Semiconductor Solutions and Reliable MicroSystems.


"What’s New: Intel Foundry has announced the onboarding of new defense industrial base (DIB) customers, Trusted Semiconductor Solutions and Reliable MicroSystems, as part of the third phase of the Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) efforts under the Trusted & Assured Microelectronics (T&AM) Program in the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)). The RAMP-C project, awarded through the Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Authority (OTA), allows DIB customers to take advantage of Intel Foundry’s leading-edge Intel 18A process technology and advanced packaging for prototypes and high-volume manufacturing of commercial and DIB products for the U.S. Department of Defense (DoD)."


I know I'm getting old. I need to inhale and exhale several times to finish these two sentences. 🤨😓🤔
 
"What’s New: Intel Foundry has announced the onboarding of new defense industrial base (DIB) customers, Trusted Semiconductor Solutions and Reliable MicroSystems, as part of the third phase of the Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) efforts under the Trusted & Assured Microelectronics (T&AM) Program in the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)). The RAMP-C project, awarded through the Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Authority (OTA), allows DIB customers to take advantage of Intel Foundry’s leading-edge Intel 18A process technology and advanced packaging for prototypes and high-volume manufacturing of commercial and DIB products for the U.S. Department of Defense (DoD)."


I know I'm getting old. I need to inhale and exhale several times to finish these two sentences. 🤨😓🤔

I ran it through AI :unsure: :

A polished version of your text:

Intel Foundry Advances RAMP-C Program with New Defense Industrial Base Customers

Intel Foundry has announced the addition of two new defense industrial base (DIB) customers, Trusted Semiconductor Solutions and Reliable MicroSystems, as part of the third phase of the Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) initiative. This effort falls under the Trusted & Assured Microelectronics (T&AM) program, overseen by the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)).

Through the RAMP-C project, awarded under the Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Authority (OTA), DIB customers gain access to Intel Foundry’s cutting-edge Intel 18A process technology and advanced packaging solutions. These capabilities enable the development of prototypes and high-volume manufacturing of both commercial and defense products for the U.S. Department of Defense (DoD).

Let me know if you'd like further adjustments!
 
"What’s New: Intel Foundry has announced the onboarding of new defense industrial base (DIB) customers, Trusted Semiconductor Solutions and Reliable MicroSystems, as part of the third phase of the Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) efforts under the Trusted & Assured Microelectronics (T&AM) Program in the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)). The RAMP-C project, awarded through the Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Other Transaction Authority (OTA), allows DIB customers to take advantage of Intel Foundry’s leading-edge Intel 18A process technology and advanced packaging for prototypes and high-volume manufacturing of commercial and DIB products for the U.S. Department of Defense (DoD)."


I know I'm getting old. I need to inhale and exhale several times to finish these two sentences. 🤨😓🤔

What needs to be mentioned: no, the tiny defence procurement order did not go to TSMC's US fab. At such lot sizes, and irregular orders, they wouldn't be interesting consumers for TSMC to begin with.

Everyone who was bullish at making defence electronics in USA don't know much about how it's done.
 
My knowledge is VERY dated, but it used to be that Navy vessel electronics were designed to operate in an unusually high radiation field so that all the electronics didn't just burn up in the event of a nearby nuclear detonation.

Part of making transistors "Hardened" in this way was keeping the trace widths pretty wide. There were other things done as well, but the gist of it was that cutting edge fine pitched chips were for consumer stuff. The military stuff was MUCH more conservative for reasons of robustness under combat conditions.

Does anyone know if this is still the case?
 
It cannot compete in the commercial market, it can only turn to the defense sector for help.
 
My knowledge is VERY dated, but it used to be that Navy vessel electronics were designed to operate in an unusually high radiation field so that all the electronics didn't just burn up in the event of a nearby nuclear detonation.

Part of making transistors "Hardened" in this way was keeping the trace widths pretty wide. There were other things done as well, but the gist of it was that cutting edge fine pitched chips were for consumer stuff. The military stuff was MUCH more conservative for reasons of robustness under combat conditions.

Does anyone know if this is still the case?
The last I worked on such things, that was still the case. Older nodes, or SOI would provide some radiation hardening. Sometimes triply-redundant circuits. These same requirements hold true for space applications.

These were never high-volume orders, but the piece price was very very good.

But in the grand scheme of running a fab, these orders would just be in the noise.
 
The last I worked on such things, that was still the case. Older nodes, or SOI would provide some radiation hardening. Sometimes triply-redundant circuits. These same requirements hold true for space applications.

These were never high-volume orders, but the piece price was very very good.

But in the grand scheme of running a fab, these orders would just be in the noise.
Thanks. My thoughts as well. The contracts also tend to be a decade or two long which is nice for stability, but not much volume.
 
Thanks. My thoughts as well. The contracts also tend to be a decade or two long which is nice for stability, but not much volume.

And you will have to maintain a speciality process operations just for that. I don't see how a large fab will go for that, even at $1m per wafer, as the opportunity cost is just so huge.
 
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