Intel Details PowerVia Chipmaking Tech: Backside Power Performing Well, On Schedule For 2024
Ultimately, PowerVia is perhaps the single biggest make-or-break moment for Intel in terms of fully recovering momentum and potentially retaking leadership within the silicon lithography business. If Intel can deliver on its promises, the company is expecting to be at least two years ahead of TSMC and Samsung in deploying backside power delivery – and that means at least two years of reaping the cost and performance benefits of the technology. TSMC for its part is not expecting to deploy backside power until its N2P node in late 2026 or early 2027, while it remains unclear when Samsung will make their own transition.
As for Intel, if everything continues to go to plan, Intel will begin high volume manufacturing with PowerVia in 2024, when the company is scheduled to bring both its Intel 20A and Intel 18A processes online. The first consumer processor to launch using the technology will be Intel’s Arrow Lake architecture, which will be a future generation Core product built on the 20A node.