Array
(
    [content] => 
    [params] => Array
        (
            [0] => /forum/index.php?threads/intel-celebrates-significant-progress-at-its-ohio-silicon-heartland-fabs.21353/
        )

    [addOns] => Array
        (
            [DL6/MLTP] => 13
            [Hampel/TimeZoneDebug] => 1000070
            [SV/ChangePostDate] => 2010200
            [SemiWiki/Newsletter] => 1000010
            [SemiWiki/WPMenu] => 1000010
            [SemiWiki/XPressExtend] => 1000010
            [ThemeHouse/XLink] => 1000970
            [ThemeHouse/XPress] => 1010570
            [XF] => 2021370
            [XFI] => 1050270
        )

    [wordpress] => /var/www/html
)

Intel celebrates significant progress at its Ohio Silicon Heartland fabs

Daniel Nenni

Admin
Staff member
 Intel Ohio Fab.

Credit: Intel

Intel has achieved notable construction progress at its upcoming Ohio fabs in Licking County, reports local ABC affiliate WSYX TV 6. Team Blue reports that the basements are now ready and the next stage involves constructing the floors. Likewise, four massive superloads have been delivered, and Intel shared a glimpse of one of the largest cranes in the world at the construction site.

In 2021, Intel announced an investment of over $28 billion to construct two bleeding-edge chip manufacturing campuses in Licking County. While initial progress has been slow, with the fabs potentially delayed to 2026 or 2027, Intel seems to be picking up pace as the Silicon Heartland takes shape.

Jim Evers, Vice President of Intel Ohio, reports that over five million labor hours have been invested in constructing these units. The basements are now complete and the team will shift focus to constructing the main floors now. Moreover, four superloads are also available on-site — with one weighing in at 916,000 pounds resulting in a nine-day road closure. Superloads are large shipments that carry equipment and materials to these fabs; they can be as long as an entire football field.

Commemorating this feat, a team from Intel visited fourth- and fifth-grade students at Johnstown Intermediate Elementary. The students were shown an image of the Liebherr LR, capable of lifting 5.5 million pounds or 400 adult-sized elephants. They coined the giant crane "Mrs. Armstrong," reflecting the role of girls in STEAM and envisioning women on the moon.

Intel Ohio Fab
Despite all the glam and glitter, Intel is yet to clarify if these fabs will go live anytime soon. Constructing a fabrication unit is one thing; setting it up and making sure everything is up to scratch is another. It may take Intel another year or two until these campuses can operate at full steam.

As it stands, Intel is the largest single private-sector investor in Ohio's history. Bringing the ambitious project to fruition is imperative for Intel, given its dire financials. This is also a crucial moment for the US as it advances to secure its future in semiconductor manufacturing. These new fabrication units are expected to add roughly $2.7 billion to Ohio's GDP and create almost 20,000 job vacancies from supporting businesses in the Silicon Heartland ecosystem.

 
 Intel Ohio Fab.

Credit: Intel

Intel has achieved notable construction progress at its upcoming Ohio fabs in Licking County, reports local ABC affiliate WSYX TV 6. Team Blue reports that the basements are now ready and the next stage involves constructing the floors. Likewise, four massive superloads have been delivered, and Intel shared a glimpse of one of the largest cranes in the world at the construction site.

In 2021, Intel announced an investment of over $28 billion to construct two bleeding-edge chip manufacturing campuses in Licking County. While initial progress has been slow, with the fabs potentially delayed to 2026 or 2027, Intel seems to be picking up pace as the Silicon Heartland takes shape.

Jim Evers, Vice President of Intel Ohio, reports that over five million labor hours have been invested in constructing these units. The basements are now complete and the team will shift focus to constructing the main floors now. Moreover, four superloads are also available on-site — with one weighing in at 916,000 pounds resulting in a nine-day road closure. Superloads are large shipments that carry equipment and materials to these fabs; they can be as long as an entire football field.

Commemorating this feat, a team from Intel visited fourth- and fifth-grade students at Johnstown Intermediate Elementary. The students were shown an image of the Liebherr LR, capable of lifting 5.5 million pounds or 400 adult-sized elephants. They coined the giant crane "Mrs. Armstrong," reflecting the role of girls in STEAM and envisioning women on the moon.

Intel Ohio Fab
Despite all the glam and glitter, Intel is yet to clarify if these fabs will go live anytime soon. Constructing a fabrication unit is one thing; setting it up and making sure everything is up to scratch is another. It may take Intel another year or two until these campuses can operate at full steam.

As it stands, Intel is the largest single private-sector investor in Ohio's history. Bringing the ambitious project to fruition is imperative for Intel, given its dire financials. This is also a crucial moment for the US as it advances to secure its future in semiconductor manufacturing. These new fabrication units are expected to add roughly $2.7 billion to Ohio's GDP and create almost 20,000 job vacancies from supporting businesses in the Silicon Heartland ecosystem.


Intel officially broke ground of its Ohio fabs on September 9, 2022. Two years has passed since then but Intel just completed its basements. Is it too slow at this speed?
 
I see this news as a little bit of pressure from Intel regarding the delayed funding for the CHIP Act :ROFLMAO:

— Yes, we have a big project here that can create jobs and income for your parents while helping us revitalize America.
— so why hasn’t the busy construction site built the building after 2 years?
— Oh, it’s because the government hasn’t allocated the funds. As the contractor, we have worked very hard; we have excellent machinery and have been putting in long hours, but the government hasn’t fulfilled its promise.
 
Did they really announce the basements being finished. Low bar literally 😭


"Jim Evers, Vice President of Intel Ohio, reports that over five million labor hours have been invested in constructing these units. The basements are now complete and the team will shift focus to constructing the main floors now. "

~ From the Yahoo article @Daniel Nenni posted above.
 
Having worked on billion dollars plus projects, construction management is key. Mega project management is literally rocket science and not just good trades. Good coordination, engineering and planning from the outset is key. I have seen mistakes slow down major projects and have done system wide trouble shooting on a multibillion, complex projects. Speed is critical for money costs on these projects is huge and the interest piles up very quickly.
 
I will just put it this way. In China the building would be complete at this point.

TSMC Japan set the bar pretty high for a fab build (2 years). It was nicknamed Night Castle since work was around the clock. I don't know the history of Intel fab builds but I would guess Ohio will be a longer than usual build. Intel can point fingers but the bottom line is that Intel cannot fill those fabs at this time so there is no urgency. With shrinking revenues, TSMC outsourcing, and a longer than expected foundry customer ramp, I don't expect those fabs to be fully equipped in the next five years.

And you commemorate this event by visiting an elementary school? :ROFLMAO: Times sure have changed....
 
Intel delayed the OH fab due to lack of demand. It will come up in 2028 wafers out BEST CASE (Plan was 2025 then 2026). The real worry is Arizona delay and impact to JV.... not sure what Intel will officially announce
 
Are we really certain about that? Lack of demand? What if Intel brought more wafers inhouse including the GPU wafers?
 
Are we really certain about that? Lack of demand? What if Intel brought more wafers inhouse including the GPU wafers?
Intel is unlikely to have GPU tile production in-house in the near future due to several factors: (1) Intel’s GPUs are primarily mid-range, requiring them to be cost-competitive; (2) Intel ranks third in the GPU market; and (3) GPU tiles are larger and thus more prone to defects.
 
Intel is unlikely to have GPU tile production in-house in the near future due to several factors: (1) Intel’s GPUs are primarily mid-range, requiring them to be cost-competitive; (2) Intel ranks third in the GPU market; and (3) GPU tiles are larger and thus more prone to defects.
> All the more reasons to bring them to their Fabs
for 2nd I don't have anything to comment
> Depends on the GPU in place Intel can do modest 200mm2 GPU
 
Intel is calling it the "shell ahead strategy" :ROFLMAO: Meaning you have a fab without equipment and customers. :ROFLMAO: It is also called the "build it and they will come" strategy. :ROFLMAO:

Pat Gelsinger: Given our shell ahead strategy and the investments that we've made over the last several years, we have a lot of flexibility to scale up if market conditions require for our products, but also if market conditions require for our foundry customers as well.

Very different from TSMC who builds fabs based on customer orders.
 
Intel is calling it the "shell ahead strategy" :ROFLMAO: Meaning you have a fab without equipment and customers. :ROFLMAO: It is also called the "build it and they will come" strategy. :ROFLMAO:

Pat Gelsinger: Given our shell ahead strategy and the investments that we've made over the last several years, we have a lot of flexibility to scale up if market conditions require for our products, but also if market conditions require for our foundry customers as well.

Very different from TSMC who builds fabs based on customer orders.
back in the day we did shell ahead all the time. because Intel was growing, if we didnt need it this year, we would need it next year. great strategy

Intel is not growing now. Closing old fabs and abandoning planned fabs will happen unless Intel can stop losing market share. It has already started.

IF Intel delivers on 18A for foundry customer, then those customers will commit to Intel in the future. but that not until 2026-2027
 
TSMC Japan set the bar pretty high for a fab build (2 years). It was nicknamed Night Castle since work was around the clock. I don't know the history of Intel fab builds but I would guess Ohio will be a longer than usual build. Intel can point fingers but the bottom line is that Intel cannot fill those fabs at this time so there is no urgency. With shrinking revenues, TSMC outsourcing, and a longer than expected foundry customer ramp, I don't expect those fabs to be fully equipped in the next five years.
The Chinese seem to build their fabs in like a year and a half. By the second year they would be moving tools in. Probably starting trial production. TSMC Japan was built in a similar time scale. Which is quite impressive and shows the high priority the Japanese government gave to the project.

We know how long it takes to build anything in the US. At least we aren't talking about the California High-Speed Rail project here.
 
It is possible to build a fab in the US in 2-2.5 years.... intels original plans were for that. This assumes the plant is approved. government and infrastructure can add time if not approved. Intel delayed it as they dont even need Fab 62 in 2026 at this point. Even if Intel brings all wafers home (which it will not). It doesnt need four 18A/14A fabs.
 
Intel is calling it the "shell ahead strategy" :ROFLMAO: Meaning you have a fab without equipment and customers. :ROFLMAO: It is also called the "build it and they will come" strategy. :ROFLMAO:

Pat Gelsinger: Given our shell ahead strategy and the investments that we've made over the last several years, we have a lot of flexibility to scale up if market conditions require for our products, but also if market conditions require for our foundry customers as well.

Very different from TSMC who builds fabs based on customer orders.

Intel's Shell Ahead Strategy, at this moment, is designed to milk more taxpayers' money without commiting to product and production timeline.

Why? Because Intel is short of cash and revenue is shrinking.

Do Department of Commerce and DoD know that? Sure they do. That's why government wants to use milestone based scheme to deliver the CHIPS Act grants money.
 
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