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Absolute nonsense. TSMC raised CAPEX to accommodate Intel at 3nm and I can assure you the Apple and AMD wafer agreements pre dated Intel's and will be honored as such.
“One lie has the power to tarnish a thousand truths.” And social media is a scourge of lies that overpowers truth, absolutely.
Here's another lie filled article. These people get paid per click so there is no room for the truth:
Intel Grabs Majority of TSMC's 3nm Capacity, 4 Products Including A GPU & 3 Server Chips In The Works With First Delivery In Q2 2022TSMC has reportedly won a huge order of its 3nm process node from Intel who will be using the new technology to develop its next-gen chips.wccftech.com
Clearly this is a pro Intel push trying to spread AMD FUD, my opinion. The funny thing is that it's an Intel failure that brought them to TSMC and it is going to be very difficult for Intel to go back to internal manufacturing. TSMC and the surrounding ecosystem is very sticky.
For the first time AMD and Intel will be on the same process node so it will be a design competition. AMD has the advantage since N3 is their third TSMC node (N7, N5, and N3) and it will be Intel's first.
It will also be a manufacturing contest between Intel and TSMC since similar Intel designs will be on Intel 4 and TSMC N3. This really is a disruptive move by Intel that could very well push them to a fab light model, absolutely.
Nikkei reports Apple should be first but Intel may have more volume: https://www.windowscentral.com/intel-apple-tsmc-3nm-report
"Read my lips - No New Taxes".But Pat Gelsinger said the majority of Intel products will be manufactured by Intel? What is going on here?
That is pretty sneaky. As for the financial situation, I wonder if the cooperation with TSMC is going to help them or hurt their financials as they basically lose some advantages of vertical integration."Read my lips - No New Taxes".
I'm not 100% certain, but he may have held to that: just increased the old ones instead.
Returning to the matter in hand:
"The majority of Intel products will be manufactured by Intel" does not mean the same as
"The majority of Intel product will be manufactured by Intel"
The following is not what is going to happen, but Intel could make one sample of each product and not merely the majority, but every Intel product will have been manufactured by Intel.
I think it'll help their financials honestly. My understanding is that Intel fabs are at a significant cost disadvantage. I don't see major advantages in 2021 to being vertically integrated as a foundry.That is pretty sneaky. As for the financial situation, I wonder if the cooperation with TSMC is going to help them or hurt their financials as they basically lose some advantages of vertical integration.
I think it'll help their financials honestly. My understanding is that Intel fabs are at a significant cost disadvantage. I don't see major advantages in 2021 to being vertically integrated as a foundry.
That UDN report said nothing about “box out ….”. We all know that is not how it works in the foundry business.Here is the original article that caused all of this nonsense:
That UDN report said nothing about “box out ….”. We all know that is not how it works in the foundry business.
There is nothing new about Intel’s 3nm order however that report did fill in more detail about the order. It said Intel has completed 3 CPUs and 1 GPU engineering runs in TSMC Fab 12 and is ready to move to Fab18B in 2022/7. The initial order is 4k.
If true, my interpretation is that the Intel CPU design team is learning how to work with the foundry by taking part in the risk production of 3nm. Apparently, the team is satisfied with the engineering samples. Wafer agreements for 2023 should be set by now. Indeed, with the level playing field, the CPU design competition is on.
The whole report is pretty much summarized again in that graph. If we look at the issue from the CPU design team’s point of view, they are handicapped by the incompetence of the process division. We know the problem is “staying away from EUV for too long”. Now, with 3nm at their disposal, they must show the world they know how to design. These 3 CPUs (server or client sides) should be the most important 3 in their product lines. One other thing is where the packaging/testing was done? Internal, TSMC, or third party. This should tell us how strong Intel’s packaging division is.I used Google translate on the article but could not translate the graphic. What did it say? My understanding was that the Intel products are on the client side not the server side. If I had to bet the over/under on who ships N3 based chips by Jan 1, 2023 I would say Apple under, Intel over, and AMD way over.