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Here came more info about 5N4Y now, from intel Ann Kelleher in SPIE AL 2024.
1. intel 7 is in HVM
2. intel 4 is in HVM ramp
3. Intel 3 is manufacturing ready
4. intel 20A manufacturing ready in 2024
5. intel 18A Silicon goes into the fab in Q1 2024.
source: https://www.vibrantlightgallery.com/
Wasn't HA-EUV supposed to be a big part of angstrom level chips? Not to mention the contract Intel signed with TSMC to manufacture their 3nm CPUs. Intel keeps telling me 5N4Y is on-track, but I feel like we all envisioned something different when they announced it. Saying "Silicon goes into Fab Q1 2024" makes me think they are making product, not that they set a wafer inside the machine to start trying to calibrate the mirrors.
Wasn't HA-EUV supposed to be a big part of angstrom level chips? Not to mention the contract Intel signed with TSMC to manufacture their 3nm CPUs. Intel keeps telling me 5N4Y is on-track, but I feel like we all envisioned something different when they announced it. Saying "Silicon goes into Fab Q1 2024" makes me think they are making product, not that they set a wafer inside the machine to start trying to calibrate the mirrors.
Usually A0 TI, after 3 months, PF skew corners and multiple baseline silicon finish characterization at SORT, Chip and system level probably between another couple dash stepping or in the case of one foundry many many all layer steppings. Comes down to how mature was the PDK, agressive timing and narrow window the platform has. No use ramping a low yielding like Samsung or Intel original 10nm.