Array
(
    [content] => 
    [params] => Array
        (
            [0] => /forum/index.php?threads/intel%E2%80%99s-3-5-billion-boondoggle.19811/page-2
        )

    [addOns] => Array
        (
            [DL6/MLTP] => 13
            [Hampel/TimeZoneDebug] => 1000070
            [SV/ChangePostDate] => 2010200
            [SemiWiki/Newsletter] => 1000010
            [SemiWiki/WPMenu] => 1000010
            [SemiWiki/XPressExtend] => 1000010
            [ThemeHouse/XLink] => 1000970
            [ThemeHouse/XPress] => 1010570
            [XF] => 2021370
            [XFI] => 1050270
        )

    [wordpress] => /var/www/html
)

Intel’s $3.5 Billion Boondoggle

50% TSMC content is, effectively, a tipping point. Intel is fab lite (and shell heavy).

I think building fab shells has strategic optionality, that makes it worth it; think how much advertising and positive press Intel gets for some steel and concrete. And Intel has shown a talent for banking shells and then finding a use later. Fab 42 in AZ is an example.

Just don't confuse fab shells with manufacturing power. I don't see any signs of Intel or Samsung closing the gap with TSMC. It bears watching and a little speculation, but I see more signs of Intel rejuvenation being TSMC-powered.
There have to be cheaper ways of buying PR and advertising than building Potemkin village fab shells.

And no one's ever succeeded in semiconductors by hedging their bets.
 
Back
Top