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EUV mask absorber issue

Fred Chen

Moderator
At this year's SPIE, there are indications current EUV masks have problems with the Ta-based absorbers, leading to image fading.

Image fading has been covered in two papers:



I also covered it without paywall with less detail, mainly indicating the greater risk for stochastic defects: https://www.linkedin.com/pulse/euv-...-stochastic-defect-floor-frederick-chen-osfjc

Image fading leads to reduced contrast (i.e., difference between maximum and minimum intensities in an image).

Since image fading is a complex 3D mask effect, intense calculations are needed to assess this effect fully. This is a good role to be filled by the new cuLitho computational lithography platform.

Low-n absorbers replacing the Ta-based absorber (effectively enabling phase-shift masks) are widely proposed (including the two linked SPIE papers) to be the way to mitigate the image fading, but are not without other issues to be addressed.
 
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Using extreme ultra violent lithography (EUV-L) within semiconductor manufacturing is reminiscent to a continuous game of Whac-A-Mole given that whenever an issue is resolved a new one pops up.
 
Low-n absorbers replacing the Ta-based absorber (effectively enabling phase-shift masks) are widely proposed (including the two linked SPIE papers) to be the way to mitigate the image fading, but are not without other issues to be addressed.
In particular, the wavelength dependence of fading is more severe with low-n: https://www.spiedigitallibrary.org/...-EUV-lithography/10.1117/12.2600931.short#_=_ EUV is not just 13.5 nm but practically spans13.2-13.8 nm.

Also the phase shift depends on pitch and line orientation: Understanding and measuring EUV mask 3D effects (spiedigitallibrary.org)
Ru phase shift vs pitch H and V.png
 
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