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ASML tool accumulation for advanced nodes

Fred Chen

Moderator
2018Q1-2020Q2 ArFi vs EUV accumulation.png

A plot of accumulated immersion and EUV tools from Q1 2018 to Q2 2020 (from ASML's quarterly financial presentations) shows about 4x the accumulation rate for immersion compared to EUV. Assuming the WPD for immersion to be double (at least) compared to EUV, there is a difference in total wafer output rate of at least 8x. TSMC still has lots of immersion layers.
 
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