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Anna Fontanelli Defines the Future of Co-Design For SemiWiki


Staff member
Rome – September 13, 2023

Monozukuri CEO, Anna Fontanelli, in a wide-ranging interview with SemiWiki editor, Dan Nenni, provided a glimpse into the future of MZ Technologies and silicon/package co-design.

Read the entire interview here:

Here’s some interview highlights:
  • “We’re making good progress toward achieving the objective we set eight years ago … we’ve our technology and generated revenue across Asia and Europe, so now it makes sense for us to bring our expertise to North America.”

  • “We’re taking on one of the industry’s thorniest problems: Creating the technology design nexus that transforms visions of the future into tomorrow’s innovative IC reality.”

  • “GENIO™ redefines the co-design of next generation heterogeneous microelectronic systems by dramatically improving the automation of integrated silicon and package EDA flows through three-dimensional interconnect optimization.”
  • “There’s nothing like GENIO today, because it was built from the ground-up. Most of the tools that attempt to do what GENIO does are what we refer to as “bolt-ons” … capabilities are literally mashed on to another in hopes of overcoming a new set of design challenges.”

  • GENIO, is built from the ground-up. Its system optimization from a unique dedicate cockpit that supports a 3D-aware cross-hierarchical pathfinding algorithm and a rule-based methodology that delivers single-step interconnect optimization throughout the entire 3D system hierarchy.”

  • “The next generation of GENIO will extend the tool’s front-end capabilities for simulation-aware system interconnect optimization and early-on system analysis. The early-on system analysis capability will be very robust. It will include state-of-the-art TSV models with R/C electrical performance and mechanical/thermal behavior. It will also provide thermal modeling based on power dissipation map and TSVs contribution.

  • About Monozukuri
Monozukuri’s mission is to conquer 2.5D & 3D design challenges for next generation electronic products by delivering innovative, ground-breaking EDA software solutions and methodologies. The technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.

Media contact

Michele Taliercio

Link to Press Release