One of the video’s first statements “Why is TSMC having trouble manufacturing it?”
(Some good discussion in here about CoWoS-L vs CoWoS-S also)
Her explanation seems to indicate the total wattage translates to a lot of heat, which causes thermal expansion issues at the substrate level causing connections to move around / disconnect. She contrasts this with the previous gen having the same issues but less overall size / heat / etc to worry about.
(Some good discussion in here about CoWoS-L vs CoWoS-S also)
Her explanation seems to indicate the total wattage translates to a lot of heat, which causes thermal expansion issues at the substrate level causing connections to move around / disconnect. She contrasts this with the previous gen having the same issues but less overall size / heat / etc to worry about.