Establishing advanced chip packaging capabilities domestically is essential to ensuring US economic and national security. Today’s major announcement – that assembly and test MNC Amkor will build a $2 billion facility near TSMC’s Fab 21 advanced manufacturing complex in Phoenix – confirms longstanding business collaboration and trust between the two companies. As part of Amkor’s media statement, TSMC CEO CC Wei stated today: ““Amkor has been a strategic OSAT partner to TSMC for many years. TSMC applauds Amkor for investing in the future of the semiconductor industry with us in Arizona. We share Amkor’s excitement for its significant investment and the value this facility will bring to TSMC, our customers, and the ecosystem.”
finance.yahoo.com
Amkor to build $2 billion Arizona semiconductor packaging plant
Amkor will build an advanced semiconductor plant to package and test chips for Apple produced at a nearby TSMC facility.