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Alchip Technologies Shows Advanced Technology At TSMC Technology Symposium


Staff member
San Jose, CA, April 26, 2023 – Alchip Technologies, Ltd. the high-performance ASIC leader, will exhibit today at TSMC’s 2023 Technology Symposium, where it will highlight its CoWoS® (chip-on-wafer-on-substrate) and chiplet design plans. The company is in the 3DFabricTM Alliance section of the Partner Pavilion, Booth 508.

At its booth, Alchip will demonstrate ASIC-industry leading high-performance computing design expertise and its flexible engagement model. It will emphasis its fast-ramping dedicated chiplet design methodology and discuss developments at advanced process technology nodes.


The Alchip Technologies booth at the 2023 TSMC North America Technology Symposium.

About Alchip

Alchip Technologies Ltd., is a leading global provider of silicon and design and production services for system companies developing complex and high-volume ASICs and SoCs. The company provides faster time-to market and cost-effective solutions for SoC design at mainstream and advanced technologies. The company has built its reputation as a high-performance ASIC leader through its advanced 2.5D/3D package services, CoWoS/chiplet design and manufacturing experience. Alchip is listed on the Taiwan Stock Exchange (TWSE: 3661), is a TSMC-certified Value Chain Aggregator, and is a founding member of the TSMC 3DFabric Alliance®.

For more information, please visit our website:

News Release Contacts

Corporate Marketing, Alchip Technologies
Chuck Byers
TEL: +1 (408) 310-9244

Link to Press Release