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Intel Prepares HBM Killer: HB3DM Memory Stacks with Z-Angle Technology

XYang2023 said:

www.techpowerup.com

Intel Prepares HBM Killer: HB3DM Memory Stacks with Z-Angle Technology

Intel and SoftBank, through their subsidiary Saimemory, have been developing an alternative technology to the popular high-bandwidth memory (HBM) to provide more bandwidth and capacity for memory modules used with powerful AI accelerators. At VLSI 2026 in June, Saimemory is scheduled to present...
www.techpowerup.com

Click to expand...
This is basically HBM, next generation. It's still vertically stacked DRAM dies with TSV connections on top of logic base die.
 
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